报告清单

[55]Power Semiconductor IGBT Packaging Technology and Reliability

Yameng Sun student Wuhan University

P /P2 2021年08月27日 12:10~12:15

公开张贴报告

[54]Research on A Novel Parallel Resonant DC Link Soft-switching Inverter Based on SiC MOSFET

Si Li doctoral candidate Harbin Institute of Technology

P /P5 2021年08月27日 12:30~12:35

公开张贴报告

[53]Comparison of the Influence of Reverse Conduction on EMI of WBG And Si Devices

Ru Zhang School of Electrical Engineering； Xi’an Jiaotong University

P /P4 2021年08月27日 12:00~12:05

公开张贴报告

[52]A Novel ACDC Single-Phase Bridgeless SEPIC PFC Converter With Reduced Conduction Losses and Simple Structure

Xiang Lin Shanghai University

P /P5 2021年08月27日 12:55~13:00

公开张贴报告

[51]Ultra-thin Coupled Inductor for a GaN-Based CRM Buck Converter

Ming Hua Nanjing Research Institute of Electronics Technology

P /P2 2021年08月27日 12:40~12:45

公开张贴报告

[50]Degradation mechanism of AlGaN/GaN HEMT based on high temperature reverse bias stress

Meng Lu Xiangtan University

P /P4 2021年08月27日 12:40~12:45

公开张贴报告

[49]Mode Switchover Strategy for Multi-port Energy Router Based on State Flow Diagram

Zhiguo Wei China University of Geosciences (Wuhan)

P /P5 2021年08月27日 13:20~13:25

公开张贴报告

[48]A Dynamic Current Sharing Method in Multi-chip SiC Power Module Using Stacked DBC Bridges and Decoupling Capacitors Based on the Original Simple Module Layout

Jianwei Lv Huazhong University of Science and Technology

P /P4 2021年08月27日 12:45~12:50

公开张贴报告

[47]Automated SiC MOSFET Power Module Switching Characterization Test Platform

Shuhao Yang Fudan University

P /P3 2021年08月27日 12:45~12:50

公开张贴报告

[46]LLC Resonant Converter Based on Trench Gate SiC MOSFET

Jinkun Chu Anhui University of Technology

P /P5 2021年08月27日 13:10~13:15

公开张贴报告

IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WIPDA-ASIA 2021)

[55]Power Semiconductor IGBT Packaging Technology and Reliability

[54]Research on A Novel Parallel Resonant DC Link Soft-switching Inverter Based on SiC MOSFET

[53]Comparison of the Influence of Reverse Conduction on EMI of WBG And Si Devices

[52]A Novel ACDC Single-Phase Bridgeless SEPIC PFC Converter With Reduced Conduction Losses and Simple Structure

[51]Ultra-thin Coupled Inductor for a GaN-Based CRM Buck Converter

[50]Degradation mechanism of AlGaN/GaN HEMT based on high temperature reverse bias stress

[49]Mode Switchover Strategy for Multi-port Energy Router Based on State Flow Diagram

[48]A Dynamic Current Sharing Method in Multi-chip SiC Power Module Using Stacked DBC Bridges and Decoupling Capacitors Based on the Original Simple Module Layout

[47]Automated SiC MOSFET Power Module Switching Characterization Test Platform

[46]LLC Resonant Converter Based on Trench Gate SiC MOSFET

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