报告清单

[157]Tutorial 8: Design Advances in High Frequency Power Converters with Wide Bandgap Devices ---Part 2 Magnetics

Zhe Zhang Technical University of Denmark；Bainan Sun Infineon Technologies；Hongbo Zhao Aalborg University；Zhan Shen Aalborg University

T2 /T2 2021年08月25日 17:00~18:00

仅限参会人课程

[156]Design Advances in High Frequency Power Converters with Wide Bandgap Devices ---Part1 Power Loop Impedance Control

Zhe Zhang Technical University of Denmark；Bainan Sun Infineon Technologies；Hongbo Zhao Aalborg University；Zhan Shen Aalborg University

T2 /T2 2021年08月25日 16:00~17:00

仅限参会人课程

[155]Thermal Design and Optimization of SiC Power Module

Zhiqiang Wang Huazhong University of Science and Technology；Tong Wu ON Semiconductor

T2 /T2 2021年08月25日 14:30~15:30

仅限参会人课程

[154]Resonant Gate Drivers For SiC Devices In High Frequency, High Power Density Applications

Han Peng Huazhong University of Science and Technology

T2 /T2 2021年08月25日 13:30~14:30

仅限参会人课程

[153]Advanced Packaging Technologies for Silicon Carbide Devices and Their Reliability Issues

Nan Jiang Hefei Comprehensive National Science Center

T1 /T1 2021年08月25日 17:00~18:00

仅限参会人课程

[152]Sintered-Silver Bonding (SSB) for Power Packaging: Its Science and Practice

Yunhui Mei Tianjin Polytechnic University

T1 /T1 2021年08月25日 16:00~17:00

仅限参会人课程

[151]High Frequency Power Conversion with SiC Power Devices for The High Voltage Power Supply with Fast Transient Response

Saijun Mao Fudan University

T1 /T1 2021年08月25日 14:30~15:30

仅限参会人课程

[150]Multi-MHz Power Conversion Technology Based on GaN Devices

Guan Yueshi Harbin Institue of Technology；Yijie Wang Harbin Institute of Technology；Dianguo Xu Harbin Institute of Technology

T1 /T1 2021年08月25日 13:30~14:30

仅限参会人课程

[149]Investigation on Parameter Extraction for An Improved Fourier-Series-Based NPT IGBT Model

Yifei Ding Hunan University

公开张贴报告

[148]Effects of p-type Islands Configuration on the Electrical Characteristics of the 4H-SiC Trench MOSFETs with Integrated Schottky Barrier Diode

zhanwei shen Institute of Semiconductors, Chinese Academy of Sciences

P /P1 2021年08月27日 12:50~12:55

公开张贴报告

IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WIPDA-ASIA 2021)

[157]Tutorial 8: Design Advances in High Frequency Power Converters with Wide Bandgap Devices ---Part 2 Magnetics

[156]Design Advances in High Frequency Power Converters with Wide Bandgap Devices ---Part1 Power Loop Impedance Control

[155]Thermal Design and Optimization of SiC Power Module

[154]Resonant Gate Drivers For SiC Devices In High Frequency, High Power Density Applications

[153]Advanced Packaging Technologies for Silicon Carbide Devices and Their Reliability Issues

[152]Sintered-Silver Bonding (SSB) for Power Packaging: Its Science and Practice

[151]High Frequency Power Conversion with SiC Power Devices for The High Voltage Power Supply with Fast Transient Response

[150]Multi-MHz Power Conversion Technology Based on GaN Devices

[149]Investigation on Parameter Extraction for An Improved Fourier-Series-Based NPT IGBT Model

[148]Effects of p-type Islands Configuration on the Electrical Characteristics of the 4H-SiC Trench MOSFETs with Integrated Schottky Barrier Diode

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