报告清单

[131]New powder core material and its new applications

Yunfan Zhang R&D manager POCO Holding co., ltd.

IS /IS 2021年08月27日 09:20~09:45

仅限参会人口头报告

[130]TMR-Based current sensor with core-less design for high-frequency current detection

Xiaopeng Xu Sinomags Technology Co., LTD

IS /IS 2021年08月27日 08:55~09:20

仅限参会人口头报告

[129]SiC Power Modules for Rail Traction & SST applications

Siqing Lu Deputy Section Chief Mitsubishi Electric

IS /IS 2021年08月27日 08:30~08:55

仅限参会人口头报告

[126]The Research of High Frequency, High Efficiency and High Power Density (3H) Application for GaN Devices

Yong Kang Huazhong University of Science and Technology；School of Electrical and Electronic Engineering

K /K1 2021年08月26日 10:30~11:10

仅限参会人特邀报告

[123]Technology Trends of SiC Chips and Modules

Kondo Harufusa Mitsubishi Electric

K /K2 2021年08月26日 14:30~15:10

仅限参会人特邀报告

[122]Development of High Voltage SiC Power MOSFETs

Song Bai State Key Laboratory of Wide Bandgap Semiconductor Power Electronic Devices

K /K2 2021年08月26日 15:10~15:50

仅限参会人特邀报告

[121]WBG Power Devices and Digital Design Framework: Challenges, Possibilities, Opportunities

Stig Munk-Nielsen Aalborg University

K /K2 2021年08月26日 16:00~16:40

仅限参会人特邀报告

[120]Designing Wide Bandgap Power Electronic Systems

Alan Mantooth UNIVERSITY OF ARKANSAS

K /K1 2021年08月26日 09:40~10:20

仅限参会人特邀报告

[119]Next Generation of Power Supplies: EV On-Board Charger

Fred C. Lee Virginia Tech

K /K1 2021年08月26日 09:00~09:40

仅限参会人特邀报告

[117]A Multi Time-Scale Electro-thermal Co-Simulation Approach of SiC-MOSFET Considering Distribution of Electro-thermal Stress on Chip

Xin Li Naval University of Engineering

Room1

仅限参会人口头报告

IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WIPDA-ASIA 2021)

[131]New powder core material and its new applications

[130]TMR-Based current sensor with core-less design for high-frequency current detection

[129]SiC Power Modules for Rail Traction & SST applications

[126]The Research of High Frequency, High Efficiency and High Power Density (3H) Application for GaN Devices

[123]Technology Trends of SiC Chips and Modules

[122]Development of High Voltage SiC Power MOSFETs

[121]WBG Power Devices and Digital Design Framework: Challenges, Possibilities, Opportunities

[120]Designing Wide Bandgap Power Electronic Systems

[119]Next Generation of Power Supplies: EV On-Board Charger

[117]A Multi Time-Scale Electro-thermal Co-Simulation Approach of SiC-MOSFET Considering Distribution of Electro-thermal Stress on Chip

重要日期

会议日期

主办单位

承办单位

联系方式

历届会议