Advanced Packaging Technologies for Silicon Carbide Devices and Their Reliability Issues IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia WIPDA-ASIA 2021

编号：153 访问权限：仅限参会人更新：2021-08-30 13:38:02 浏览：597次课程

报告开始：2021年08月25日 17:00（Asia/Shanghai）

报告时间：60min

所在会场：[T1] Tutorial Session 1 [T1] Tutorial Session 1

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Advanced Packaging Technologies for Silicon Carbide Devices and Their Reliability Issues

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Hefei Comprehensive National Science Center

IEEE
IEEE ELECTRONIC DEVICE SOCIETY

Huazhong University of Science and Technology

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IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WIPDA-ASIA 2021)