A Dynamic Current Sharing Method in Multi-chip SiC Power Module Using Stacked DBC Bridges and Decoupling Capacitors Based on the Original Simple Module Layout
编号:48 访问权限:公开 更新:2021-07-21 20:02:20 浏览:178次 张贴报告

报告开始:2021年08月27日 12:20(Asia/Shanghai)

报告时间:1min

所在会场:[P] Poster [P1] Poster 1

摘要
The dynamic current sharing between the parallel SiC chips is important in multi-chip SiC modules. This paper presents a dynamic current sharing method in multi-chip SiC module without changing the original simple module layout. This method is based on stacked DBC bridges and decoupling capacitors. Decoupling capacitors are soldered on the stacked DBC bridges distributed between the SiC chips connecting the DC+ and DC- electrodes. By this method, distributed decoupling structure is achieved without changing the original simple module layout. The module structure, the design process and the fabrication process are kept simple, and the dynamic current imbalance is reduced. This method is easier to implement than other dynamic current sharing methods. This method is verified by simulations and experiments. Compared with the original structure without this method and the concentrated-decoupling structure, dynamic current imbalance of the improved structure using this method is reduced significantly.
关键词
dynamic current sharing, multichip SiC modules, paralleled SiC MOSFETs, distributed decoupling capacitors
报告人
Jianwei Lv
Huazhong University of Science and Technology

稿件作者
Jianwei Lv Huazhong University of Science and Technology
Chi Zhang Huazhong University of Science and Technology
Cai Chen Huazhong University of Science and Technology;State Key Laboratory of Advanced Electromagnetic Engineering and Technology
Yong Kang Huazhong University of Science and Technology;School of Electrical and Electronic Engineering
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重要日期
  • 会议日期

    08月25日

    2021

    08月27日

    2021

  • 04月21日 2021

    摘要截稿日期

  • 05月15日 2021

    摘要录用通知日期

  • 06月25日 2021

    终稿截稿日期

  • 08月24日 2021

    报告提交截止日期

  • 08月27日 2021

    注册截止日期

主办单位
IEEE
IEEE ELECTRONIC DEVICE SOCIETY
承办单位
Huazhong University of Science and Technology
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