Power Semiconductor IGBT Packaging Technology and Reliability
编号:55 访问权限:公开 更新:2021-08-19 14:37:34 浏览:174次 张贴报告

报告开始:2021年08月27日 12:13(Asia/Shanghai)

报告时间:1min

所在会场:[P] Poster [P1] Poster 1

摘要
Recently, IGBT has found an increasingly wide utilization, resulting in higher power density and thermal flux difficulty, which promotes the researches of new materials and structures to face up to the challenges of thermal reliability. As the crucial step in the packaging process, the reflow process is also an important part of the quality control, while typical IGBT module will result in large residual stress and warpage due to various temperature characteristics and the thermal mismatch of packaging materials. Existing researches mainly improve the quality of welding by changing the control mode, however, the cost is high and the manufacture is difficult. In this work, the thermal conduction of double-sided cooling IGBT modules in the reflow process and the reliability in the presence of voids were analyzed. Furthermore, transient temperature gradient was explored by a thermal simulation model, meanwhile, the reflow temperature curve of solder layer, the temperature gradient curve, and the influence of the void rate on the junction temperature of the chip was optimized and evaluated. The result indicates that the temperature gradient of the solder layer reduced by 50%, and the junction temperature of chip increased by approximately 3℃ when the void rate changed from 0% to 3%.
关键词
packaging,IGBT,Reflow process,Void Rate
报告人
Yameng Sun
student Wuhan University

稿件作者
Yameng Sun Wuhan University
Shizhao Wang Wuhan University
Lianghao Xue Wuhan University
Zheng Feng Wuhan University
Rui Li Wuhan University
Sheng Liu Wuhan University
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重要日期
  • 会议日期

    08月25日

    2021

    08月27日

    2021

  • 04月21日 2021

    摘要截稿日期

  • 05月15日 2021

    摘要录用通知日期

  • 06月25日 2021

    终稿截稿日期

  • 08月24日 2021

    报告提交截止日期

  • 08月27日 2021

    注册截止日期

主办单位
IEEE
IEEE ELECTRONIC DEVICE SOCIETY
承办单位
Huazhong University of Science and Technology
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