报告清单

[29]A Low-Cost Quadruple-Node-Upset Self-Recoverable Latch Design

Yan Wen Student ChangSha university of science and technology

SS /SS1 2021年08月19日 20:00~20:20

仅限参会人口头报告

[18]Volume diagnosis progress / challenges

Ruifeng Guo Synopsys, USA；Wu-Tung Cheng Siemens Digital Industries Software, USA

IS /IS3 2021年08月20日 11:30~11:50

仅限参会人口头报告

[17]Accuracy and scalability of physically aware diagnosis for yield learning

Wu-Tung Cheng Siemens Digital Industries Software, USA

IS /IS3 2021年08月20日 12:10~12:30

仅限参会人口头报告

[16]Advancements in Diagnosis and Yield

Sameer Chillarige Cadence

IS /IS3 2021年08月20日 11:50~12:10

仅限参会人口头报告

[15]Combining structural and functional monitoring for improving overall safety and reliability of automotive ICs

Nilanjan Mukherjee Siemens Digital Industries Software

IS /IS2 2021年08月19日 22:50~23:10

仅限参会人口头报告

[14]Advanced solutions to address automotive test & reliability challenges

Yervant Zorian Synopsys

IS /IS2 2021年08月19日 22:30~22:50

仅限参会人口头报告

[13]Challenges and case-studies in ensuring automotive quality on nanoscale SOCs

David Francis Texas Instruments, USA

IS /IS2 2021年08月19日 22:10~22:30

仅限参会人口头报告

[12]Bringing 1149.10 to life

J-F Cote Siemens Digital Industries Software；Geir Eide Siemens Digital Industries Software

IS /IS1 2021年08月19日 21:45~22:05

仅限参会人口头报告

[11]Solving test challenges in adopting serial scan for production

Ed Seng Teradyne Inc；Marc Hutner Teradyne Inc

IS /IS1 2021年08月19日 21:25~21:45

仅限参会人口头报告

[9]Emerging Need for Fast Thermal and Dynamic Voltage Drop Predictors for the Optimization of Scan/Functional Test Patterns

Norman Chang Chief Technologist ANSYS, Inc

PS /PS2 2021年08月20日 10:45~11:30

仅限参会人主旨报告

2021 IEEE International Test Conference in Asia (ITC-Asia 2021)

[29]A Low-Cost Quadruple-Node-Upset Self-Recoverable Latch Design

[18]Volume diagnosis progress / challenges

[17]Accuracy and scalability of physically aware diagnosis for yield learning

[16]Advancements in Diagnosis and Yield

[15]Combining structural and functional monitoring for improving overall safety and reliability of automotive ICs

[14]Advanced solutions to address automotive test & reliability challenges

[13]Challenges and case-studies in ensuring automotive quality on nanoscale SOCs

[12]Bringing 1149.10 to life

[11]Solving test challenges in adopting serial scan for production

[9]Emerging Need for Fast Thermal and Dynamic Voltage Drop Predictors for the Optimization of Scan/Functional Test Patterns

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