With the test technology facing its grand challenges to ensure the quality of ICs and electronic systems incorporating more and more sophisticated manufacturing processes and system integration technologies in various emerging applications such as Internet of Things, cloud computing, automotive electronics, etc., global proliferation and cooperation is increasingly more important. International Test Conference has been a flagship conference in test technology since 1970. With an attempt to stimulate more discussion and interaction between the academia and the industry around the globe, the 1st ITC-Asia was initiated in Taipei in 2017, and the 2nd ITC-Asia was held with great success in Harbin China in 2018. The 3rd ITC-Asia will be held in Tokyo Japan in 2019. Attendee can involve themselves in attractive sessions on the state-of-the-art test technology trend and several industry topics. We kindly invite you to submit your work to ITC-Asia 2019. The outstanding papers with extension will be invited to ITC-2019.
Regular paper submissions should be made electronically by PDF manuscripts only, not exceeding 6 pages in IEEE 2-column format (including abstract, figures, tables, and bibliography). A submission will be considered evidence that upon acceptance at least one author will attend the conference to make the presentation. Authors of accepted papers are also responsible for preparing the final manuscripts in time to be included in the electronic proceeding. Conference content will be submitted for inclusion into IEEE Xplore as well as other Abstracting and Indexing (A&I) databases. At least one full registration to the conference is required for each accepted paper.
Topics of Interests include (but are not limited to) the following topics:
Autonomous Testing
Heterogeneous Testing
Reliability and Testing for Approximate/Quantum Computing
Hardware Oriented Security and Trust
Design Validation and Debug
ATE Design
Analog and Mixed-Signal Test
RF Test
High-Speed I/O Test
Fault Modeling and Simulation
ATPG (Automatic Test Pattern Generation)
Design for Testability
Built-In Self-Test
Delay Test
System-on-Chip Test
Test Compression
Power-Aware and/or Thermal-Aware Test
Memory Test, Diagnosis, and Repair
Fault Diagnosis and Failure Analysis
Yield Analysis and Learning
Safety and Test for Automotive ICs
Test for Internet of Things
Test for Emerging Devices
CPU/GPU Test
MEMS/Sensor Test
Online Test
On-Chip Measurement
SiP, 2.5D, and 3D IC Test
Interconnect Test
Board-Level Testing and Diagnosis
Test Standards
Test Economics
Reliability Issues
Fault Tolerance
Test for Reconfigurable Systems
Software Test and Reliability
Dependable Systems and Networks
09月03日
2019
09月05日
2019
初稿截稿日期
注册截止日期
2022年08月24日 台湾-中国 Taipei
2022 IEEE International Test Conference in Asia2021年08月18日 中国 Shanghai
2021 IEEE International Test Conference in Asia2018年08月15日 中国
2018 IEEE International Test Conference in Asia2017年09月13日 台湾-中国 Taipei
2017 IEEE International Test Conference in Asia2014年11月10日 中国 杭州市
IEEE International Test Conference in Asia
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