With the test technology facing its grand challenges to ensure the quality of ICs and electronic systems incorporating more and more sophisticated manufacturing processes and system integration technologies in various emerging applications such as Internet of Things, cloud computing, automotive electronics, etc., global proliferation and cooperation is increasingly more important. International Test Conference has been a flagship conference in test technology since 1970. With an attempt to stimulate more discussion and interaction between the academia and the industry around the globe, the 1st ITC-Asia was initiated in Taipei in 2017, and the 2nd ITC-Asia was held with great success in Harbin China in 2018. The 3rd ITC-Asia will be held in Tokyo Japan in 2019.
Attendee can involve themselves in attractive sessions on the state-of-the-art test technology trend and several industry topics. We kindly invite you to submit your work to ITC-Asia 2021. The outstanding papers with extension will be invited to ITC-2021.
Steering Committee Members
Kuen-Jong Lee (Chair) | National Cheng Kung Univ. |
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Cheng-Wen Wu | National Tsing Hua Univ. |
Li-C. Wang (representing ITC) | UCSB |
Yervant Zorian (representing TTTC) | Synopsys |
Xiaowei Li | Inst. of Comput. Technology, CAS |
Tutorial Chair
Pingqiang Zhou | Shanghai Tech University |
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Jiang Li | Shanghai Jiaotong University |
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Krishnendu Chakrabarty | Duke University |
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Tomoo Inoue | Hiroshima City University |
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Jianhui Jiang | Tongji University |
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Zebo Peng | Linköping University |
Jing Ye | Inst. of Comput. Technology, CAS |
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Gang Qu | University of Maryland |
Ying Zhang | Tongji University |
Yu Huang | HiSilicon |
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Hongming Zhu | Tongji University |
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Shi-Yu Huang | National Tsing Hua Univ |
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Zezhi He | Shanghai Jiaotong University |
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Davide Appello | STMicroelectronics | Jin-Fu Li | National Central University |
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John Carulli | GLOBALFOUNDRIES | Katherine Shu-Min Li | National Sun Yat-Sen University |
Mango Chao | National Chiao Tung University | Huaguo Liang | Hefei University of Technology |
Vivek Chickermane | Cadence Design Sstems | Dimitris Nikolos | University of Patras |
Stephan Eggersglüß | Mentor Graphics | Alex Orailoglu | University of California San Diego |
Masahiro Fujita | The University of Tokyo | Ilia Polian | University of Stuttgart |
Anne Gattiker | IBM | Janusz Rajski | Mentor, A Siemens Business |
Dimitris Gizopoulos | University of Athens | Matteo Sonza Reorda | Politecnico di Torino |
Charles H.-P. Wen | National Chiao Tung University | Juergen Schloeffel | Mentor Graphics |
Sybille Hellebrand | University of Paderborn | Saghir Shaikh | Braodcom Ltd. |
Hao-Chiao Hong | National Yang Ming Chiao Tung University | Virendra Singh | Indian Institute of Technology (IIT) Bombay |
Jiun-Lang Huang | National Taiwan University | Hiroshi Takahashi | Ehime University |
Shi-Yu Huang | National Tsing Hua University, Taiwan | Mark Tehranipoor | University of Florida |
Tsung-Chu Huang | National Changhua University of Education | Kar Meng Thong | Infineon Technologies Asia Pacific |
Michiko Inoue | Nara Institute of Science and Technology | Daniel Tille | Infineon Technologies AG |
Tomoo Inoue | Hiroshima City University | Hans Tsai | Mentor Graphics |
Masahiro Ishida | ADVANTEST Corporation | Jerzy Tyszer | Poznan University of Technology |
Li Jiang | Shanghai Jiao Tong University | Gherman Valentin | CEA |
Seiji Kajihara | Kyushu Institute of Technology | Sying-Jyan Wang | National Chung Hsing University |
Sungho Kang | Yonsei University | Xiaoqing Wen | Kyushu Institute of Technology |
Haruo Kobayashi | Gunma University | Dong Xiang | Tsinghua University |
Huawei Li | Institute of computing, Chinese Academy of Sciences | Qiang Xu | The Chinese University of Hong Kong |
Regular paper submissions should be made electronically by PDF manuscripts only, not exceeding 6 pages in IEEE 2-column format (including abstract, figures, tables, and bibliography). A submission will be considered evidence that upon acceptance at least one author will attend the conference to make the presentation. Authors of accepted papers are also responsible for preparing the final manuscripts in time to be included in the electronic proceeding. Conference content will be submitted for inclusion into IEEE Xplore as well as other Abstracting and Indexing (A&I) databases. At least one full registration to the conference is required for each accepted paper.
Topics of Interests include (but are not limited to) the following topics:
Autonomous Testing
Heterogeneous Testing
Reliability and Testing for Approximate/Quantum Computing
Hardware Oriented Security and Trust
Design Validation and Debug
ATE Design
Analog and Mixed-Signal Test
RF Test
High-Speed I/O Test
Fault Modeling and Simulation
ATPG (Automatic Test Pattern Generation)
Design for Testability
Built-In Self-Test
Delay Test
System-on-Chip Test
Test Compression
Power-Aware and/or Thermal-Aware Test
Memory Test, Diagnosis, and Repair
Fault Diagnosis and Failure Analysis
Yield Analysis and Learning
Safety and Test for Automotive ICs
Test for Internet of Things
Test for Emerging Devices
CPU/GPU Test
MEMS/Sensor Test
Online Test
On-Chip Measurement
SiP, 2.5D, and 3D IC Test
Interconnect Test
Board-Level Testing and Diagnosis
Test Standards
Test Economics
Reliability Issues
Fault Tolerance
Test for Reconfigurable Systems
Software Test and Reliability
Dependable Systems and Networks
08月18日
2021
08月20日
2021
初稿截稿日期
提前注册日期
报告提交截止日期
注册截止日期
2022年08月24日 台湾-中国 Taipei
2022 IEEE International Test Conference in Asia2019年09月03日 日本 Tokyo
2019 IEEE International Test Conference in Asia2018年08月15日 中国
2018 IEEE International Test Conference in Asia2017年09月13日 台湾-中国 Taipei
2017 IEEE International Test Conference in Asia2014年11月10日 中国 杭州市
IEEE International Test Conference in Asia
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