2016年第23届国际集成电路物理失效分析研讨会 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits IPFA

活动简介

The 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2016) is organized by the IEEE Reliability/CPMT/ED Singapore Chapter. The Symposium is technically co-sponsored by the IEEE Electron Device Society and IEEE Reliability Society.

IPFA 2016 will be devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability and yield, especially those related to advanced process technologies.

征稿信息

重要日期

2016-02-05

摘要截稿日期

2016-05-20

初稿截稿日期

2015-03-11

初稿录用日期

2016-05-20

终稿截稿日期

The Technical Programme Committee is inviting papers related, but not limited to, the following areas:

Sample Preparation, Metrology and Defect Characterization
Die-Level/Package/System-Level Failure Analysis Case Studies
Advanced Fault Isolation Techniques
Advanced Physical Failure Analysis Techniques
Front-End of Line (FEOL) Reliability
Back-End of Line (BEOL) Reliability
Package-Level Reliability
Non-Volatile Memory (NVM) and Non-Silicon Device Reliability

Prospective authors are requested to submit one cover page and a two-page summary (includes text and figures) of their previously unpublished and original research work. Please refer the paper submission page for more information.