The 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits ( IPFA 2017 ) is organized by the IEEE Reliability / CPMT / ED Singapore Chapter, IEEE Electron Devices Society Chengdu Chapter and the University of Electronic Science and Technology of China ( UESTC ) . The Symposium is technically co-sponsored by the IEEE Electron Device Society and IEEE Reliability Society.
IPFA 2017 will be devoted to the fundamental understanding of the physical mechanisms governing failure in a large variety of advanced semeconductor devices and the electrical - physical failure analysis techniques, methodologies and tools that could be use to reliably identify the root cause of failure in these devices.
The Technical Programme Committee is inviting papers related, but not limited to, the following areas:
Sample Preparation, Metrology and Defect Characterization
Die-Level / Package / System-Level Failure Analysis Case Studies
Advanced Fault Isolation Techniques
Advanced Physical Failure Analysis Techniques
Front-End of Line ( FEOL ) Reliability
Back-End of Line ( BEOL ) Reliability
Package-Level Reliability
Non-Volatile Memory ( NVM ) and Non-Silicon Device Reliability
07月04日
2017
07月07日
2017
摘要截稿日期
初稿截稿日期
初稿录用通知日期
终稿截稿日期
注册截止日期
2023年07月23日 马来西亚 Pulau Pinang
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