AboutComponents, Circuits, Devices and Systems; Computing and Processing; Engineered Materials, Dielectrics and Plasmas; Photonics and Electrooptics; Power, Energy and Industry Applications; Signal Processing and Analysis
Keywords:Device Reliability,Failure Analysis,Integrated circuit,Failure mode,Failure mechanism,Reliability Assessment,Fault Isolation,Design for Reliabiltiy,Electrical Characterization,Electron Devices,Physics of Failure,Test and diagnostic,Wide band gap semiconductors,Power Electronics,Electrostatic Discharge (ESD),System Level Failure,Physical Failure Analysis,Metrology,AI applications in FA,AI applications in Reliability,NVM Reliability,
Scope:The 29th edition of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2022) be held in-person as a physical conference at the iconic Marina Bay Sands, Singapore from 18 - 21 July 2022. IPFA will continue to focus on the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear-out and failure in conventional and new CMOS devices, in turn resulting in improved knowhow of the physics of device / circuit / module failure that serves as critical input for future design for reliability. We are also soliciting submissions in new and upcoming research areas including failure analysis for hardware security, reliability and failure analysis of power electronics, photovoltaic technologies, 2D Nanodevices and applications of machine learning and artificial intelligence to the field of failure analysis and reliability assessments.
Sponsor Type:1; 3; 5