AboutComponents, Circuits, Devices and Systems; Computing and Processing; Engineered Materials, Dielectrics and Plasmas; Photonics and Electrooptics; Power, Energy and Industry Applications
Keywords:Reliability,Failure Analysis,Integrated Circuits,Electron Devices,Physics of Failure,Failure Mechanism,Fault Isolation,Electrical Characterization,Testing,Design for Reliability,Semiconductors,Failure Mode,
Scope:The 28th edition of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2021) will be held virtually for a month (with a half day live keynote session) from mid September to mid October. IPFA will continue to focus on the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear-out and failure in conventional and new CMOS devices, in turn resulting in improved knowhow of the physics of device / circuit / module failure that serves as critical input for future design for reliability. We are also soliciting submissions in new and upcoming areas of research that include failure analysis for hardware security, reliability and failure analysis of power electronics, photovoltaic technologies as well as 2D Nanodevices and applications of machine learning and artificial intelligence to the field of failure analysis and reliability assessment.
Sponsor Type:1; 3; 5