The 20th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2013) is organized by the IEEE Reliability/CPMT/ED Singapore Chapter, IEEE Nanjing Section ED/SSC Jiont Chapter, Soochow University, and Suzhou Institute of Electronics. The Symposium is technically co-sponsored by the IEEE Electron Device Society and IEEE Reliability Society. IPFA 2013 will be devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability, yield and performance, especially those related to advanced process technologies.