Parallel DICE Cells and Dual-Level CEs based 3-Node-Upset Tolerant Latch Design for Highly Robust Computing
编号:61 访问权限:公开 更新:2021-08-16 20:35:47 浏览:324次 口头报告

报告开始:2021年08月20日 11:30(Asia/Shanghai)

报告时间:20min

所在会场:[RS] Regular Paper Session [RS3] A4 Circuit Design and Evaluation with Emerging Technology

摘要
Dr. Aibin Yan is an IEEE/CCF Senior Member, a PhD supervisor and an Associate Professor with School of Computer Science and Technology, Anhui University (AHU), China. He received a Ph.D degree in Computer Application Technology from Hefei University of Technology, China, and a M.S. degree in Software Engineering from the University of Science and Technology of China (USTC), Hefei, in 2015 and 2009, respectively. He joined Anhui University, Hefei, in 2016. During 2018.9-2019.9, he visited the WEN Lab, Kyushu Institute of Technology, Japan, under the support of China Scholarship Council (CSC), and under the supervision of Prof. Xiaoqing WEN, an IEEE Fellow, for a full year of time. During that year, he participated in chip design, tape out and test. On July 2021, he created the AHU Institute of Chip Design and Test serving as a director. In recent years, he served as a Session Chair of 52nd IEEE International Symposium on Circuits and Systems, Publicity Chair and TPC Member of 27th IEEE Asian Test Symposium. His research interests mainly include radiation hardening by design for nano-scale CMOS ICs such as latches, flip-flops, and memory cells. Details can be found through his website: http://ca.hfut.edu.cn/xyz/
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报告人
Aibin Yan
Associate professor Anhui University

Dr. Aibin Yan is an IEEE/CCF Senior Member, a PhD supervisor and an Associate Professor with School of Computer Science and Technology, Anhui University (AHU), China. He received a Ph.D degree in Computer Application Technology from Hefei University of Technology, China, and a M.S. degree in Software Engineering from the University of Science and Technology of China (USTC), Hefei, in 2015 and 2009, respectively. He joined Anhui University, Hefei, in 2016. During 2018.9-2019.9, he visited the WEN Lab, Kyushu Institute of Technology, Japan, under the support of China Scholarship Council (CSC), and under the supervision of Prof. Xiaoqing WEN, an IEEE Fellow, for a full year of time. During that year, he participated in chip design, tape out and test. On July 2021, he created the AHU Institute of Chip Design and Test serving as a director. In recent years, he served as a Session Chair of 52nd IEEE International Symposium on Circuits and Systems, Publicity Chair and TPC Member of 27th IEEE Asian Test Symposium. His research interests mainly include radiation hardening by design for nano-scale CMOS ICs such as latches, flip-flops, and memory cells. Details can be found through his website: http://ca.hfut.edu.cn/xyz/

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重要日期
  • 会议日期

    08月18日

    2021

    08月20日

    2021

  • 05月10日 2021

    初稿截稿日期

  • 08月16日 2021

    提前注册日期

  • 08月19日 2021

    报告提交截止日期

  • 08月20日 2021

    注册截止日期

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