How to make chip intelligent – from an architecture perspective
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报告开始:2021年08月19日 09:30(Asia/Shanghai)

报告时间:45min

所在会场:[PS] Plenary Session(Openning, Keynotes 1-6) [PS1] Openning and Keynote 1/2/3

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摘要
In recent years, the development of artificial intelligence (AI) becomes a hot spot. Obviously, in order to realize the application of AI, integrated circuit is an inevitable choice that constitutes the AI system together with software. However, AI algorithms vary in different applications and the algorithms have been continuing to evolve. Meanwhile, AI services are migrating from the cloud to the edge nowadays. Performance demands and power consumption constraints require AI to be deployed on an energy-efficient computing engine.
For a long time, the application specific integrated circuits (ASICs) can achieve the optimization of performance and cost due to their very specified application scenarios. However, in the era of AI, ASICs are facing severe challenges to meet simultaneously the requirements of high performance, low power consumption and high flexibility. Reconfigurable architecture is the ideal solution for intelligent computing since its programmability and dynamic re-configurability of architecture can adapt algorithm evolution and diversity of applications and greatly improves energy efficiency as well. Furthermore, how to improve the intelligent level of chip through training and learning after deployment is an important topic for people to think and explore. This presentation will start from the discussion of architecture innovation and followed by an exploration of basic ideas and approaches to chip intelligence.
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报告人
Shaojun Wei
Professor Tsinghua University

Dr. Shaojun Wei is the professor of Tsinghua University; Chief Scientist of the State Key Science and Technology Project; Member of the National Integrated Circuit Industry Development Advisory Committee; Vice President of China Semiconductor Industry Association (CSIA) and President of Fabless Chapter CSIA. Dr. Wei was the President & CEO of Datang Telecom Technology Co., Ltd. and the CTO of Datang Telecom Industry Group between 2001-2006.
Dr. Wei has been working on VLSI design methodologies research and reconfigurable computing technology research. He has published more than 200 peer-reviewed papers and 6 monographs. He owns more than 130 patents, including 18 US patents. Dr. Wei is the IEEE Fellow, the Fellow of Chinese Institute of Electronics (CIE), the academician of the International Eurasian Academy of Science (IEAS).
Dr. Wei had won many awards including China National Second Award for Technology Invention (2015), China National Second Award for Technology Progress (2001), SIPO & WIPO Patent Golden Award (2003, 2015), First Award for Science and Technology of Ministry of Education (2014, 2019), China, First Award for Technology Invention of CIE (2012, 2017, 2020), EETimes China IC Design Achievement Award (2018), Aspencore Outstanding Contribution Award of the Year/Global Electronic Achievement Awards (2018), SEMI Special Contribution Award (2019) and IEEE CAS Industrial Pioneer Award (2020).

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重要日期
  • 会议日期

    08月18日

    2021

    08月20日

    2021

  • 05月10日 2021

    初稿截稿日期

  • 08月16日 2021

    提前注册日期

  • 08月19日 2021

    报告提交截止日期

  • 08月20日 2021

    注册截止日期

主办单位
IEEE
Tongji University
Chinese Computer Federation
承办单位
Tongji University
历届会议
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