Erik Jan Marinissen

Erik Jan Marinissen is a scientific director at the world-renowned research institute imec in Leuven, Belgium, where he is responsible for research on test and design-for-test, covering topics as diverse as TSV-based 3D-stacked ICs, silicon photonics, CMOS technology nodes below 5nm, and STT-MRAMs. In addition, he is a visiting researcher at Eindhoven University of Technology, the Netherlands. Previously, he worked at NXP Semiconductors and Philips Research Laboratories in Eindhoven. Marinissen holds an MSc degree in Computing Science (1990) and a PDEng degree in Software Technology (1992), both from Eindhoven University of Technology. He is co-author/editor of one book, author of chapters in six books, (co-)author of 275+ journal and conference papers, and (co-) inventor on 18 granted US/EP patent families. On its 50^th anniversary, the IEEE International Test Conference (ITC) announced Marinissen to be the most-cited author of ITC papers over the 25-year period 1995-2019. Subsequent reserach showed that he is in fact also the most cited author of papers published at either ITC, ITC-Asia, ATS, ETS, LATS, or VTS during 1995-2019. Marinissen is recipient of the Most Significant Paper Awards at the IEEE International Test Conferences (ITC) in 2008 and 2010, Best Paper Awards at the Chrysler-Delco-Ford Automotive Electronics Reliability Workshop 1995, the IEEE International Board Test Workshop 2002, the International Wafer-Level Packaging Conference (IWLPC) 2018, the IEEE Latin-American Test Symposium (LATS) 2019, and the DATE 2020 Conference and Exhibition, the Most Inspirational Presentation Award at the IEEE Semiconductor Wafer Test Workshop 2013, the HiPEAC Tech Transfer Award 2015, the National Instruments’ Engineering Impact Award 2017, the IEEE Standards Association Emerging Technology Award 2017. He served as Editor-in-Chief of IEEE Std 1500 and as Founder and Chair (currently Vice-Chair) of the IEEE Std 1838 Working Group on 3D test access. Marinissen is founder of the workshops ‘Diagnostic Services in Network-on-Chips’ (DSNOC), DATE’s Friday 3D Integration, and the IEEE ‘International Workshop on Testing Three-Dimensional Integrated Circuits’ (3D-TEST). He has been Program Chair of DDECS 2002, ETS 2006, 3D-TEST 2009-15, and DATE 2013, and General Chair of ETW 2003, DSNOC 2007-08, 3DIW 2009-10, and serves on numerous conference committees, including ATS, DATE, ETS, ITC, ITC-Asia and VTS. He serves on the editorial boards of IEEE ‘Design & Test’ and Springer’s ‘Journal of Electronic Testing: Theory and Applications’. During the span of his career, Marinissen has supervised 43 international MSc and PhD students. He is a Fellow of IEEE (2011), Golden Core Member of IEEE Computer Society (2005), and elected as member of the Computer Society's Board of Governors (2019-2021).