Meng Zhang*
全体主题 > Device characterization and modeling
Jingru Dai*, Bassem Mouawad, Jianfeng Li, Mark Johnson
全体主题 > Harsh environment (e.g. high temperature) operation and reliability
Bassem Mouawad*, Jordi Espina, Jianfeng Li, Lee Empringham, christopher Johnson
全体主题 > Packaging, power modules, and ICs
Xiaochuan Deng*
全体主题 > Device structures and fabrication techniques
Qing Zhu, Xiaohua Ma*
全体主题 > Harsh environment (e.g. high temperature) operation and reliability
Bin Hou*
全体主题 > Device structures and fabrication techniques
Quan Hu, Yunqian Song, Jun Liu, Zhenyu Wang*, Binbin Jiao, Rong Gao
全体主题 > Packaging, power modules, and ICs
ZHIYI ZHAO*, Yihua Hu, Yaochun Shen, Chengmin Li, Wuhua Li, Weifeng Hu
全体主题 > Packaging, power modules, and ICs
Lixiang Chen*
全体主题 > Device characterization and modeling
Chen Yu*, Mao Saijun, Li Chengmin, Li Wuhua, He Xiangning, Jelena Popovic, Jan Ferreira
全体主题 > Harsh environment (e.g. high temperature) operation and reliability
全体主题 > Device characterization and modeling
全体主题 > Packaging, power modules, and ICs
Shan Jiang, Xiao-Yan Tang*, Qingwen Song, Yuming ZHANG
全体主题 > Device structures and fabrication techniques
全体主题 > Device characterization and modeling
Junyi Yang, Lina Wang*, Xiangcai Zhang, Kabir Oladele Olanrewaju, Haobo Ma
全体主题 > Hard-switched and soft-switched applications
05月17日
2018
05月19日
2018
摘要截稿日期
摘要录用通知日期
初稿截稿日期
终稿截稿日期
注册截止日期
2023年08月27日 台湾-中国 Hsinchu
2023 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia2021年08月25日 中国 Wuhan
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia