Power Module with Large Short Term Current Capability by Using Phase Change Material终稿

Weihua Shao*, Li Ran, Zheng Zeng, Huaping Jiang, Debaprasad Kastha, Philip Mawby, Ruizu Wu, Prabodh Bajpai

全体主题 > Packaging, power modules, and ICs

Leakage Current Analytical Model and Suppression In High Frequency SiC Three-Phase Inverters终稿

Junzhong Xu, Wang Yong*, Jingwen Han, Yaosheng Lu, Houjun Tang

全体主题 > Common-mode and EMI management

DC-Link Capacitors RMS Current Reduction PWM method Based High Frequency SiC Three-Phase Inverters终稿

Junzhong Xu, Wang Yong*, Yaosheng Lu, Jingwen Han, Houjun Tang

全体主题 > Applications in renewable energy and storage, transportation, industrial drives, and grid power

Analysis of Breakdown Characteristics of AlGaN/GaN HEMTs with Double Passivation Layers终稿

Kazushige Horio*

全体主题 > Device characterization and modeling

Enhanced DC and RF Characteristics in E∕D-mode AlGaN∕GaN HEMTs by TiN-based source contact technology终稿

Ling Yang*

全体主题 > Device structures and fabrication techniques

A High Performance Isolated High Frequency Converter Based on GaN HEMT终稿

Yueshi Guan*, Yijie Wang, Xihong Hu, Wei Wang, Dianguo Xu

全体主题 > Hard-switched and soft-switched applications

A Double-sided Cooling 1200V/600A Multichip Half-bridge IGBT Module Using Nano-silver Paste as Die-attaching Material终稿

Zheng Wang, YUNHUI MEI*, Wen Liu, Yijing Xie, Shancan Fu, Xin Li, Guo-Quan Lu

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Common Mode Modeling and Reduction of GaN-based Full-bridge Inverters终稿

Wuji Meng*, Fanghua Zhang, Zirui Fu, Guangdong Dong

全体主题 > Common-mode and EMI management

high frequency dc dc converterters摘要待审

xiaoyong ren, zhiliang zhang*

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Automatic V-I Alignment for Switching Characterization of Wide Band Gap Power Devices终稿

Shan Yin*

全体主题 > Device characterization and modeling

Vertical GaN MOSFETs with Over 1.6 kV breakdown voltage :A theoretical studying终稿

yanni Zhang, zhiyu Lin*, dai Yang*, jincheng Zhang

全体主题 > Device structures and fabrication techniques

WiPDA asia 2018 Oral Biography form and presentation 756188摘要待审

全体主题 > Packaging, power modules, and ICs