195 / 2017-12-06 21:20:45
Vertical GaN MOSFETs with Over 1.6 kV breakdown voltage :A theoretical studying
GaN,mosfet,breakdown voltage,vertical stracture
终稿
yanni Zhang / Xidian University
dai Yang / Northwest University
zhiyu Lin / Xidian University
jincheng Zhang / Xidian University
Owing to its high breakdown electric field, excellent frequency characteristics, high electron drift velocity and so on, Gallium Nitride (GaN)has a great utilization potential in developing high-voltage high-power semiconductor devices. Because of the poor conductivity of the substrate or the AlN nucleation, the longitudinal conductivity of heteroepitaxial GaN material structure is not good enough. Traditionally, most GaN MOSFETs are studied using lateral structures. However, there is always a contradiction between the breakdown voltage and the area of the device, so the lateral structure does not apply to the requirements of higher pressure and device miniaturization.
In this paper, a GaN MOSFET device on a free-standing GaN substrate has been investigated. The optimization and simulation of the device structure are carried out in order to obtain the device characteristics of high voltage and high power. We design the GaN MOSFETs structure through SILVACO platform. Influence of the key parameters on the DC characteristics are investigated, such as the doping concentration of the drift and body region, the length of the drift region. The breakdown characteristics are analyzed emphatically. We find that with the increase the bulk region doping concentration ,the breakdown voltage also increases. The reason is that the increasing doping concentration can reduce the avalanche current. The analysis shows that the breakdown voltage of the vertical GaN MOSFET device can also be improved by reducing the doping concentration or increasing the length of the drift region. Design of the high voltage GaN MOSFETs is also be optimized, the doping concentration of p-GaN region is set to 9 × 1016 cm-3; the doping concentration of n-GaN drift layer is 2 × 1015 cm-3; the device on-resistance is 125 mΩ • cm and the breakdown voltage is up to 1602 V.

重要日期
  • 会议日期

    05月17日

    2018

    05月19日

    2018

  • 12月08日 2017

    摘要截稿日期

  • 01月30日 2018

    摘要录用通知日期

  • 02月10日 2018

    初稿截稿日期

  • 02月10日 2018

    终稿截稿日期

  • 05月19日 2018

    注册截止日期

主办单位
IEEE
IEEE ELECTRONIC DEVICE SOCIETY
IEEE POWER ELECTRONIC SOCIETY
中国电源学会
中国半导体产业创新联盟
承办单位
西安交通大学
西安电子科技大学
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