How to make chip intelligent – from an architecture perspective
2021 IEEE International Test Conference in Asia
Wei Shaojun Tsinghua University
PS /PS1
2021年08月19日 09:30~10:15
仅限参会人 主旨报告
Silicon Lifecycle Management for Emerging Memories
2021 IEEE International Test Conference in Asia
Zorian Yervant Synopsys
TS /TS1
2021年08月18日 09:00~12:00
仅限参会人 课程
Vibration Mitigation via Integrated Acoustic Black Holes
19th Asia-Pacific Vibration Conference
Meiyu LI student
暂无会场信息
仅限参会人 口头报告
A Two-dimensional Asymmetric Eccentric Vibration Absorber with Acoustic Black Hole Features
19th Asia-Pacific Vibration Conference
Ji Hongli Nanjing University of Aeronautics and Astronautics
暂无会场信息
仅限参会人 口头报告
Transmission Loss of Periodic Plates with Acoustic Black Holes
19th Asia-Pacific Vibration Conference
Tang Liling Northwestern Polytechnical University,School of Marine Science and Technology
暂无会场信息
仅限参会人 口头报告
Effects of Annular Acoustic Black Holes on Noise Mitigation
19th Asia-Pacific Vibration Conference
Deng Jie Northwestern Polytechnical University,Chongqing university
暂无会场信息
仅限参会人 口头报告
Numerical and Experimental Studies on Geometric Nonlinearity of an ABH Beam
19th Asia-Pacific Vibration Conference
Sun Xiang The Hong Kong Polytechnic University
暂无会场信息
仅限参会人 口头报告
Flexural wave bandgap in plate strip with embedded periodic two-dimensional acoustic black holes
19th Asia-Pacific Vibration Conference
Han Bing Nanjing University of Aeronautics and Astronautics
暂无会场信息
仅限参会人 口头报告
Vibration Control and Structural Strengthening on a Plate with Acoustic Black Holes
19th Asia-Pacific Vibration Conference
Zheng Ling Chongqing university
暂无会场信息
仅限参会人 口头报告
Vibration Absorber using Integrated Acoustic Black Holes
19th Asia-Pacific Vibration Conference
meiyu LI student
暂无会场信息
仅限参会人 口头报告
