活动简介

International Test Conference is the world’s premier venue dedicated to the electronic test of devices, boards and systems—covering the complete cycle from design verification, design- fortest, design-for-manufacturing, silicon debug, manufacturing test, system test, diagnosis, reliability and failure analysis, and back to process and design improvement. At ITC, design, test, and yield professionals can confront challenges faced by the industry, and learn how these challenges are being addressed by the combined efforts of academia, design tool and equipment suppliers, designers, and test engineers.

ITC, the cornerstone of the Test Week event, offers a wide variety of technical activities targeted at test and design theoreticians and practitioners, including: formal paper sessions, tutorials, panel sessions, case studies, invited lectures, commercial exhibits and presentations, and a host of ancillary professional meetings.

Authors are invited to submit original, unpublished papers describing recent work in the field of test and design. In addition, authors are invited to submit high quality, practical, industry best practices. Submissions simultaneously under review or accepted by another conference, symposium or journal, will be summarily rejected.

征稿信息

重要日期

2018-02-24
摘要截稿日期
2018-03-24
初稿截稿日期
2018-06-05
初稿录用日期
2018-07-24
终稿截稿日期

征稿范围

  • 3D/2.5D Test

  • Adaptive Test in Practice

  • ATE/Probe Card Design

  • Advances in Boundary Scan

  • Bring-Up

  • Data-driven Methods

  • Data Exchange and Infrastructure

  • Defect-oriented Testing

  • DFM and Test

  • Diagnosis

  • Economics of Test

  • End-to-End Data Analysis

  • End-to-End System Security

  • Embedded BIST and DFT

  • Emerging Defect Mechanisms

  • Hardware Security and Trust

  • IoT Testing

  • Jitter, High-Speed I/O and RF Test

  • Known-Good-Die testing

  • Memory Test and Repair

  • MEMS Testing

  • Mixed-Signal and Analog Test

  • New Technologies and Test

  • On-Chip Test Compression

  • Online Test

  • Pre-Silicon Verification

  • Post- Silicon Validation

  • Power Issues in Test

  • Protocol-aware Test

  • Reliability and Resilience

  • Scan Based Test

  • SoC/SiP/NoC Test

  • Silicon Debug

  • Simulation and Emulation

  • System Test (Applications)

  • System Test (Hardware/Software)

  • Test-to-Design Feedback

  • Test Escape Analysis

  • Test Flow Optimizations

  • Test Generation and Validation

  • Test Resource Partitioning

  • Test Standards

  • Test Time Analysis and Reduction

  • Testing High Speed Optics/Photonics

  • Timing Test

  • Yield Analysis and Optimization

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重要日期
  • 会议日期

    10月30日

    2018

    11月03日

    2018

  • 02月24日 2018

    摘要截稿日期

  • 03月24日 2018

    初稿截稿日期

  • 06月05日 2018

    初稿录用通知日期

  • 07月24日 2018

    终稿截稿日期

  • 11月03日 2018

    注册截止日期

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