Li Ran, Zheng Zeng*, Weihua Shao, Hao Chen, Xiaoling Li
全体主题 > Packaging, power modules, and ICs
全体主题 > Packaging, power modules, and ICs
Mursal Furqan*, Mahaveer Rathi
全体主题 > Packaging, power modules, and ICs
Tianhua ZHU*, Fang ZHUO, Feng WANG, Hailin WANG, Xinlu HE, shuhuai SHI
全体主题 > Packaging, power modules, and ICs
xijun ni*
全体主题 > Packaging, power modules, and ICs
Zeqiang Chen, Ken Li, Kai Jin, Chenxi Huang, Peng Li, Li Geng*
全体主题 > Packaging, power modules, and ICs
Chenxi Huang, Zeqiang Chen, Li Geng*, Qin Xia, Peng Li
全体主题 > Packaging, power modules, and ICs
wei gou, shiquan fan*, li geng
全体主题 > Packaging, power modules, and ICs
cheng zhao, Wang Laili*
全体主题 > Packaging, power modules, and ICs
Yang Fengtao, Wang Laili*, Cheng Zhao, Qi Zhiyuan, Wang Jianpeng, Zhang Yang, Chen Yang
全体主题 > Packaging, power modules, and ICs
Puqi Ning*, Lei Li
全体主题 > Packaging, power modules, and ICs
Bassem Mouawad*, Jordi Espina, Jianfeng Li, Lee Empringham, christopher Johnson
全体主题 > Packaging, power modules, and ICs
Quan Hu, Yunqian Song, Jun Liu, Zhenyu Wang*, Binbin Jiao, Rong Gao
全体主题 > Packaging, power modules, and ICs
ZHIYI ZHAO*, Yihua Hu, Yaochun Shen, Chengmin Li, Wuhua Li, Weifeng Hu
全体主题 > Packaging, power modules, and ICs
全体主题 > Packaging, power modules, and ICs
05月17日
2018
05月19日
2018
摘要截稿日期
摘要录用通知日期
初稿截稿日期
终稿截稿日期
注册截止日期
2023年08月27日 台湾-中国 Hsinchu
2023 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia2021年08月25日 中国 Wuhan
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia