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活动简介

The IEEE European Test Symposium (ETS) is Europe’s premier forum dedicated to presenting and discussing scientific results, emerging ideas, applications, hot topics, and new trends in the area of electronic-based circuit and system testing and reliability. In 2018, ETS will take place at Swissôtel, Bremen, Germany. It is organized by the University of Bremen, which co-sponsors the event jointly with the IEEE Council on Electronic Design Automation (CEDA). ETS traditionally enjoys a strong balance among academic and industrial participants. In addition to regular Scientific Papers, Special Sessions, Panels, and Embedded Tutorials, ETS features Vendor Sessions and Table-Top Demos as well as a special track on Emerging Test Strategies (ETS2) where new issues are presented by the industry and are discussed in an informal atmosphere. ETS is the major event of the European Test Week, which includes TSS (Test Spring School) and fringe workshops.

征稿信息

重要日期

2017-12-04
初稿截稿日期
2018-02-13
初稿录用日期
2018-03-18
终稿截稿日期

征稿范围

In summary, areas of interest include (but are not limited to):

  • Analog Test

  • ATE Hardware and Software

  • Automatic Test Generation

  • Board Test and Diagnosis

  • Boundary Scan Test

  • Built-In Self-Test (BIST)

  • Current-Based Test

  • Defect-Based Test

  • Delay and Performance Test

  • Dependability and Functional Safety

  • Design for Test (DfT)

  • Design for Manufacturing (DfM)

  • Diagnosis and Silicon Debug

  • Economics of Test

  • Test of Emerging Technologies

  • Failure Analysis

  • Fault Modeling and Simulation

  • Fault Tolerance

  • GPU Test

  • High-Speed I/O Test

  • Low-Power IC Test

  • Memory Test and Repair

  • MEMS Test

  • Microprocessor Test

  • Mixed-Signal Test

  • Multi-/Many-core Processor Test

  • Nanotechnology Test

  • On-line Test

  • Power Issues in Test

  • Reconfigurable System Test

  • Reliability

  • RF Test

  • Security and Trust Issues in Test

  • Self-Repair

  • Sensor Test

  • Signal Integrity Test

  • SiP, Stacked, 3D IC Test

  • SoC Test

  • Soft Errors

  • Standards in Test

  • Statistical Learning in Test

  • Test Compression

  • Test Quality

  • Test Synthesis

  • Thermal Issues in Test

  • Validation and Verification

  • Variability Issues in Test

  • Yield Analysis and Enhancement

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重要日期
  • 会议日期

    05月28日

    2018

    06月01日

    2018

  • 12月04日 2017

    初稿截稿日期

  • 02月13日 2018

    初稿录用通知日期

  • 03月18日 2018

    终稿截稿日期

  • 06月01日 2018

    注册截止日期

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