活动简介

The IEEE European Test Symposium (ETS) is Europe’s premier forum dedicated to presenting and discussing scientific results, emerging ideas, applications, hot topics, and new trends in the area of electronic-based circuits and system testing and reliability. In 2017, ETS will take place at Amathus Beach Hotel, Limassol, Cyprus. It is organized by the University of Cyprus, which co-sponsors the event jointly with the IEEE Council on Electronic Design Automation (CEDA).

ETS traditionally enjoys a strong balance among academic and industrial participants. In addition to regular Scientific Papers, Special Sessions, Panels, and Embedded Tutorials, ETS features Vendor Sessions and Table-Top Demos, a special track on Emerging Test Strategies (ETS2) where new issues are presented by the industry and are discussed in an informal atmosphere, as well as the new initiative of Industry Wish List where industry presents elevator talks on open issues that demand urgent solutions. ETS is the major event of the European Test Week that includes TSS (Test Spring School) and fringe workshops.

征稿信息

重要日期

2016-12-13
摘要截稿日期
2016-12-13
初稿截稿日期
2017-02-10
初稿录用日期
2017-03-17
终稿截稿日期

征稿范围

  • Analog Test

  • ATE Hardware and Software

  • Automatic Test Generation

  • Board Test and Diagnosis

  • Boundary Scan Test

  • Built-In Self-Test (BIST)

  • Current-Based Test

  • Defect-Based Test

  • Delay and Performance Test

  • Dependability and Functional Safety

  • Design for Test (DfT)

  • Design for Manufacturing (DfM)

  • Diagnosis and Silicon Debug

  • Economics of Test

  • Emerging Technologies

  • Failure Analysis

  • Fault Modeling and Simulation

  • Fault Tolerance

  • GPU Test

  • High-Speed I/O Test

  • Low-Power IC Test

  • Memory Test and Repair

  • MEMS Test

  • Microprocessor Test

  • Mixed-Signal Test

  • Multi-/Many-core Processor Test

  • Nanotechnology Test

  • On-line Test

  • Power Issues in Test

  • Reconfigurable System Test

  • Reliability

  • RF Test

  • Security and Trust Issues in Test

  • Self-Repair

  • Sensor Test

  • Signal Integrity Test

  • SiP, Stacked, 3D IC Test

  • SoC Test

  • Soft Errors

  • Standards in Test

  • Statistical Learning in Test

  • Test Compression

  • Test Quality

  • Test Synthesis

  • Thermal Issues in Test

  • Validation and Verification 

  • Variability Issues in Test

  • Yield Analysis and Enhancement 

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重要日期
  • 会议日期

    05月22日

    2017

    05月26日

    2017

  • 12月13日 2016

    摘要截稿日期

  • 12月13日 2016

    初稿截稿日期

  • 02月10日 2017

    初稿录用通知日期

  • 03月17日 2017

    终稿截稿日期

  • 05月26日 2017

    注册截止日期

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