COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips 20 is to be held in Yokohama on April 19-21, 2017.
Low Power-High Performance Processors for Multimedia, Digital Consumer Electronics, Mobile, Graphics, Encryption, Robotics, Automotive, Networking, Medical, Healthcare, and Biometrics.
Novel Architectures and Schemes for Single Core, Multi/Many-Core, Embedded Systems, Reconfigurable Computing, Grid, Ubiquitous, Dependable Computing, GALS and Wireless.
Cool Software including Parallel Schedulers, Embedded Real-time Operating System, Binary Translations, Compiler Issues and Low Power Techniques.
04月19日
2017
04月21日
2017
摘要截稿日期
摘要录用通知日期
初稿截稿日期
注册截止日期
2024年04月17日 日本 Tokyo
2024 IEEE Symposium in Low-Power and High-Speed Chips2021年04月14日 日本 Tokyo
2021 IEEE Symposium in Low-Power and High-Speed Chips2018年04月18日 日本
2018 IEEE Symposium in Low-Power and High-Speed Chips2016年04月20日 日本 Yokohama, Japan
2016年IEEE低功耗和高速芯片研讨会2015年04月13日 日本
2015年IEEE低功耗和高速芯片研讨会
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