2018 IEEE Symposium in Low-Power and High-Speed Chips COOL CHIPS

活动简介

COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips and systems. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips 21 is to be held in Yokohama on April 18-20, 2018.

征稿信息

重要日期

2018-02-09

摘要截稿日期

2018-03-16

初稿录用日期

2018-03-30

终稿截稿日期

Contributions are solicited in the following areas:

Low Power-High Performance Processors for AI, IoT, Multimedia, Digital Consumer Electronics, Mobile, Graphics, Encryption, Robotics, Automotive, Networking, Medical, Healthcare, and Biometrics.
Novel Architectures and Schemes for Single Core, Multi/Many-Core, NoC, Embedded Systems, Reconfigurable Computing, Grid, Ubiquitous, Dependable Computing, GALS and 3D Integration.
Cool Software including Parallel Schedulers, Embedded Real-time Operating System, Binary Translations, Compiler Issues and Low Power Application Techniques.