2021 IEEE Symposium in Low-Power and High-Speed Chips COOL CHIPS

活动简介

IEEE COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips and systems. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips 24 is to be held as a virtual conference on April 14-16, 2021, instead of a face-to-face event in Tokyo.

Sponsor Type:1

组委会

Chair

Kunio Uchiyama (AIST)

Vice Chairs

Allen J. Baum (Esperanto Technologies)
Kyoung-Rok Cho (Chungbuk National Univ.)
Tohru Ishihara (Nagoya Univ.)
Chong–Ming Kyung (KAIST)
Rudy Lauwereins (IMEC)
Josep Torrellas (Univ.of Illinois Urbana-Champaign)

Secretaries

Yuki Kobayashi (NEC)
Hiroki Matsutani (Keio Univ.)
Yutaka Uematsu (Hitachi)

Treasurers

Yasushi Inoguchi (JAIST)
Daisuke Kobayashi (NTT)
Koyo Nitta (NTT)

Program Chairs

Fumio Arakawa (Univ. of Tokyo)
Makoto Ikeda (Univ. of Tokyo)

Publicity Chairs

Teruaki Sakata (Hitachi)
Masato Suzuki (Socionext)

Publication Chairs

Yoshio Hirose (Fujitsu)
Yasuo Unekawa (Toshiba Electronic Devices ＆ Storage)

Registration Chairs

Takuya Nakaike (IBM)
Yukinori Sato (Toyohashi Univ. of Technology)

Local Arrangement Chairs

Akihiro Hashiguchi (Sony)
Shotaro Shintani (NSITEXE)
Chikafumi Takahashi (NSITEXE)
Takumi Uezono (Hitachi)

征稿信息

重要日期

2021-02-15

初稿截稿日期

2021-03-12

初稿录用日期

征稿范围

Contributions are solicited in the following areas:

Low Power-High Performance Processors for AI, IoT, Multimedia, Digital Consumer Electronics, Mobile, Graphics, Encryption, Robotics, Automotive, Networking, Medical, Healthcare, and Biometrics.

Novel Architectures and Schemes for Single Core, Multi/Many-Core, NoC, Embedded Systems, Reconfigurable Computing, Grid, Ubiquitous, Dependable Computing, GALS and 3D Integration.

Cool Software including Parallel Schedulers, Embedded Real-time Operating System, Binary Translations, Compiler Issues and Low Power Application Techniques.