活动简介

The International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA symposium), first held in 1983, gathers experts from all over the world and has always been fruitful and productive. Every year, scientists and engineers discuss and present the state-of-the-art technology R&D and macro development of the industry’s future. It is considered the most important event in Taiwan’s semiconductor industry and highly anticipated by local companies. Taking advantage of the information learned during the conference, the symposium hopes to create new opportunities for Taiwan’s semiconductor industry. The VLSI-TSA symposium is becoming more significant since Taiwan not only occupies a prominent position in the global semiconductor industry, but also is increasingly competitive globally in IC design technology and communications information products.

The VLSI-TSA symposium is proud to create a platform for enriching technical exchange and networking between experts from all over the world. The purpose is to bring together scientists and engineers actively engaged in research, development, and manufacturing on VLSI Technology, Systems and Applications to discuss the latest progress in this field.

Sponsor Type:1; 1; 9

组委会

Chair: Emily Kuo

Co-chair: Wen-Chi Yang

General Secretariat: Emily Kuo

Secretariat: Caroline Huang

征稿信息

重要日期

2021-01-15
初稿截稿日期

征稿范围

The scope of papers requested in 2021 VLSI-TSA includes the following fields : 

•  Low power CMOS and embedded memory
•  Foundry technology
•  RF & THz process, device and integration technology 
•  Standalone memory: DRAM, FLASH, emerging memory technology
•  Advanced process modules
•  Nanopatterning: Multiple patterning, Directed Self-Assembly, EUV, etc.
•  Power and analog IC device and technology  
•  Advanced CMOS process and devices
•  Material, process and device modeling
•  TFT and organic electronics
•  MEMS, imagers and sensors
•  Advanced manufacturing technology, metrology and yield
•  Reliability physics, characterization and test
•  Advanced packaging and 2.5D/3D Integration
•  Photonics and Beyond CMOS Technology
•  Energy harvesting technology
•  Wearable and loE enabling technologies
•  Neuromorphic devices and materials for brain-inspired computing 
•  Quantum phenomena and information technologies
•  Device technologies for AI deep learning applications
•  2D Electronics

留言
验证码 看不清楚,更换一张
全部留言
重要日期
  • 会议日期

    04月19日

    2021

    04月22日

    2021

  • 01月15日 2021

    初稿截稿日期

  • 04月22日 2021

    注册截止日期

主办单位
IEEE Electron Devices Society IEEE Solid-State Circuits Society Industrial Technology Research Institute - ITRI
历届会议
移动端
在手机上打开
小程序
打开微信小程序
客服
扫码或点此咨询