Low power CMOS and embedded memory Foundry technology RF process, device and integration technology Standalone memory: DRAM, FLASH, emerging memory technology Advanced process modules: e.g. gate stack, junction, strain/channel engineering, low-R contact, low-C spacer/ILD, interconnect technology, ALE and selective deposition, etc. Nanopatterning: Multiple patterning, Directed Self-Assembly, EUV, etc. Power and analog IC device and technology Advanced CMOS process and devices: Ge, SiGe, III-V, FinFET, GAA, 2D materials/1D nanowires Material, Process and device modeling TFT and organic electronics MEMS, imagers and sensors Advanced manufacturing technology, metrology and yield Reliability physics, characterization and test Advanced packaging and 2.5D/3D Integration Photonics and Beyond CMOS Technology Energy harvesting technology Wearable and loE enabling technologies Neuromo
04月16日
2018
04月19日
2018
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2021年04月19日 台湾-中国 Hsinchu
2021 International Symposium on VLSI Technology, Systems and Applications2019年04月22日 台湾-中国 Ambassador Hotel Hsinchu
2019 International Symposium on VLSI Technology, Systems and Application
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