活动简介
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the Components, Packaging and Manufacturing Technology (CPMT) Society of the IEEE. The 2014 ECTC will be held at the Walt Disney World Swan and Dolphin Resort, Lake Buena Vista, Florida, USA.
征稿信息

征稿范围

Advanced Packaging Session 1: Interposer Technologies Session 8: Flip Chip Packaging & Advanced Substrate Session 13: 3D Process Integration & Die Stacking Session 21: Wafer-Level & Fan-Out Packages Session 27: Sensors & MEMS Technologies
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重要日期
  • 会议日期

    05月27日

    2014

    05月30日

    2014

  • 05月30日 2014

    注册截止日期

主办单位
IEEE Components, Packaging and Manufacturing Technology Societ
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