2031 30th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ITherm

活动简介

Sponsored by the IEEE's Electronics Packaging Society (EPS), ITherm 2022 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.

ITherm 2022 will be held along with the 72^nd Electronic Components and Technology Conference (ECTC 2022 - http://www.ectc.net), a premier electronics packaging conference at the Sheraton Hotel & Marina, San Diego, CA, USA. Joint registrations will be available at a discounted rate. In addition to paper presentations and vendor exhibits, ITherm 2022 will include panel discussions, keynote lectures by prominent speakers, invited technology talks, ECTC/ITherm joint networking events and short courses, and a student design competition.

All papers will be peer reviewed and published in the ITherm proceedings. Student first authors will have the opportunity to apply for ITherm travel grants in order to make an oral presentation and participate in a Student Poster and Networking Session.

Sponsor Type:1

征稿信息

重要日期

2030-09-20

摘要截稿日期

Originality and significance of the work
Quality of data/results and interpretation
Completeness of the manuscript
Non-commercial nature of the manuscript
References to the work of others
Literary quality (clarity in writing, organization, figures, tables, etc.)
Good use of technical/written English is expected. In cases where sentence structure, grammar, and understandability are not adequate, the technical program committee may require a strong copy-edit by you or your institution as a condition for acceptance of the final paper.