Original papers are solicited in the following general areas of interest (but not limited to):

Thermal-1 Component Level --Track I

• Single/Multi-Chip Module, System in Package

• 3D Packaging, Embedded Cooling

• Heat Pipes, Vapor Chambers, Thermosyphons

• Heat Spreaders

• Hot Spot Cooling

• Thermoelectric

• Single & Two-Phase Cold Plates

• Pumps, Fans

• Heat Exchangers, Air Cooling

Thermal-2 System Level --Track II

• Data Center, Energy Efficiency

• Thermal Storage

• Immersion Cooling, Refrigeration

• Mobile, Internet of Things, MEMS

• Telecommunication Systems

• Automotive

• Space and Aerospace

• Power Electronics

• LEDs

• Photovoltaics

• RF Electronics

• Battery

Mechanics & Reliability --Track III

• Thermo-mechanical Modeling and Simulation of Devices, Components, Boards, and Systems

• Mechanics and Reliability of Solder Joints & Interconnects

• Materials Characterization, Processing, Constitutive Models

• Failure Mechanics, Fatigue, Damage Modeling

• Experimental Techniques for Packaging Deformations, Strains, and Stresses

• Shock, Drop, and Vibrational Analysis of Packages, SubSystems, and Systems

• TSV / 3D Reliability and Packaging Challenges

• Mechanics issues in Assembly and Manufacturing

Emerging Technologies & Fundamentals --Track IV

• Numerical Methods from Nano-to-Macro Scale

• Experimental Methods from Nano-to-Macro Scale 

• Nanotechnology incl. 1&2-Dimensional Materials

• Thermal Interface Materials, Phase Change Materials

• Embedded Cooling

• Transistor Technology

• Novel Materials and Manufacturing Techniques

• Measurement and Instrumentation Techniques

• Prognostic Health Management and Reliability Analysis