Aim of the Conference: to cope with the rapidly progressing technology which, today, reaches the nanometer scale. The areas of interest include the design, test and technology of electronic products, ranging from integrated circuit modules and printed circuit boards to full systems and microsystems, as well as the methodologies and tools used in the design, verification and validation of such products.
Integrated Systems Design:
Integrated Systems Technology:
Integrated Systems Testing:
SOC, SIP design
Multiprocessor systems
Embedded systems
Wireless systems
Network on Chip
Analog, Mixed Signal and RF systems
MEMS and MOEMS systems
Low Voltage and Low Power systems
Innovative technologies
Synthesis (physical, logic)
Simulation, Validation and Verification
3D integration
Hardware Security
Nanoelectronics
Device modeling
Material characterization
Failure analysis
New components
Packaging
Process technology
Reliability issues
3D integration
Defect and fault modeling
Analog and Mixed Signal testing
MEMS/MOEMS testing
SOC and SIP testing
Delay testing
Memory testing
Fault Simulation, ATPG
DFT, BIST and BISR
On-line testing and fault tolerant systems
ATE issues
Alternative test strategies
3D testing
Test and Security Issues
FPGA design
04月04日
2017
04月06日
2017
注册截止日期
2018年04月09日 意大利
2018 13th International Conference on Design & Technology of Integrated Systems In Nanoscale Era2015年04月21日 意大利
2015年第10届纳米时代集成系统设计与技术国际会议
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