2018 13th International Conference on Design & Technology of Integrated Systems In Nanoscale Era DTIS

活动简介

To cope with the rapidly progressing technology which, today, reaches the nanometer scale. The areas of interest include the design, test and technology of electronic products, ranging from integrated circuit modules and printed circuit boards to full systems and microsystems, as well as the methodologies and tools used in the design, veriﬁcation and validation of such products.

征稿信息

重要日期

2018-01-06

摘要截稿日期

2018-01-06

初稿截稿日期

2018-02-26

初稿录用日期

2018-03-11

终稿截稿日期

Aim of the Conference: to cope with the rapidly progressing technology which, today, reaches the nanometer scale. The areas of interest include the design, test and technology of electronic products, ranging from integrated circuit modules and printed circuit boards to full systems and microsystems, as well as the methodologies and tools used in the design, veriﬁcation and validation of such products. Topics of the conference include, but are not limited to:

Integrated Systems Design:	Integrated Systems Technology:	Integrated Systems Testing:
• SOC, SIP design	• Nanoelectronics	• Defect and fault modeling
• Multiprocessor systems	• Device modeling	• Analog and Mixed Signal testing
• Embedded systems	• Material characterization	• MEMS/MOEMS testing
• Wireless systems	• Failure analysis	• SOC and SIP testing
• Network on Chip	• New components	• Delay testing
• Analog, Mixed Signal and RF systems	• Packaging	• Memory testing
• MEMS and MOEMS systems	• Process technology	• Fault Simulation, ATPG
• Low Voltage and Low Power systems	• Reliability issues	• DFT, BIST and BISR
• Innovative technologies	• 3D integration	• On-line testing and fault tolerant systems
• Synthesis (physical, logic)		• ATE issues
• Simulation, Validation and Verification		• Alternative test strategies
• 3D integration		• 3D testing
• Hardware Security		• Test and Security Issues
		• FPGA design