征稿已开启

查看我的稿件

注册已开启

查看我的门票

已截止
活动简介

The premier conference on thermal design, management and characterization of electronic components and systems. SEMI-THERM tackles critical thermal issues by: Addressing the entire area of electronics thermal management Providing a venue for dissemination of practical information in a timely fashion Fostering technical networking Providing opportunity for greater vendor- customer communication SEMI-THERM 31 Conference Tracks and Champions Computational Fluid Dynanmics (CFD) Analysis, Guy Wagoner Computational Fluid Dynanmics (CFD) Case Studies, John Parry Thermoelectric and Energy Harvesting, Zaruaki Yazawa System Level and Form Factor Challenges, Bill Maltz Data Centers, Nishi Ahuja Quality and Reliability, Daniel Abishai LEDs, Patrick Bournes Thermal Interface Materials (TIMs), Dave Saums Mobile and Graphics Challenges, Hussameddine Kabbani View SEMI-THERM 31 Advance Program Symposium Highlights: Internationally recognized program committee, speakers and presenters Keynote and special distinguished speakers throughout the symposium Over 55 presented papers from the worldwide thermal community Pre-conference short courses on basic and advanced thermal topics FREE Vendor Workshops with the most recent technical information from suppliers and vendors FREE Exhibition with the highest concentration of thermal related products in the world FREE 'How-To' courses for all engineering disciplines on thermal topics that you can use every day

征稿信息
留言
验证码 看不清楚,更换一张
全部留言
重要日期
  • 会议日期

    03月15日

    2015

    03月19日

    2015

  • 03月19日 2015

    注册截止日期

主办单位
IEEE Components
Packaging and Manufacturing Technology Society
联系方式
移动端
在手机上打开
小程序
打开微信小程序
客服
扫码或点此咨询