活动简介

New for 2017, SEMI-THERM 33 will feature a Data Center Track, an entire track dedicated to addressing the impact of thermal design of IT equipment on the performance of the modern data center.

Who Should Attend:

Attendees include anyone interested in thermal design, management and characterization of electronic systems and components. SEMI-THERM provides a forum for engineers, academics, and executives to learn, exchange ideas, and display the latest in thermal management techniques, products and services. Here are some of the topics we’ve covered in past years:

New Technologies

  • Advances in Thermal Components
  • Energy Harvesting Materials
  • Thermal Control Methods
  • 3D & Nano-Technologies

Component & System Design

  • Heat Spreaders, Air Movers, TIMs
  • Design Software & Modeling
  • Processors, ICs, Memory
  • Solid State Technologies

Testing & Validation

  • Characterization & Material Measurement
  • Instrumentation & Controls
  • Reliability Testing
  • JEDEC Standards

Applications

  • Portable & Power Electronics
  • Harsh Environments
  • Telecommunications
  • Data Centers
征稿信息

重要日期

2016-09-29
摘要截稿日期
2017-01-06
初稿截稿日期
2016-10-10
初稿录用日期
2017-01-06
终稿截稿日期
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重要日期
  • 会议日期

    03月13日

    2017

    03月17日

    2017

  • 09月29日 2016

    摘要截稿日期

  • 10月10日 2016

    初稿录用通知日期

  • 01月06日 2017

    初稿截稿日期

  • 01月06日 2017

    终稿截稿日期

  • 03月17日 2017

    注册截止日期

主办单位
IEEE Components, Packaging and Manufacturing Technology Society
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