CONTENTS

 

S201 Technologies for Chip, Packaging and Modules

The rapid development of white LED in the past ten years has been focusing on light efficiency and cost. Under the environment of new economy and new driving forces in 13th Five Year Plan, what are the development opportunities for LED industry? What are the latest development of manufacturing technology of chip and package? High color rendering,  full-spectrum LED light source …. Flip chip LED into the mature period, its performance advantage and price adjustment affects not only the market trend of chip, but also the technology trend of package and module. The wide application of flip chip promotes the technological revolution of chip scale package (CSP) and FC-COB with high power and high light density, changes the situation that traditional package stents and high power ceramic package occupy important position. Recently GaN on Si based LED won the National Science and Technology Invention Award, become a hot topic in the industry again, how does it change market prospects of chip and packaging applications?

What is the latest progress and development tendency of technologies, such as LED chip process, package material, fluorescent powder coating, lens design, wafer level package and integrated optical engine driven by high voltage AC (DOB)?  What role do these technologies play in the industrial structure change in the future? Please pay attention to the latest development of chip, package and module technology.

 

Scope:

- New Progress of LED Chip Manufacturing Technologies

- Chip Shrinkage to micro-size and its technical challenges

- High Efficient UV, Blue, Green and Red Chip Technology

- Mounted Chips, Flip Chip and Vertical Chip Technology

- Latest Development of LED Packaging Materials (Substrate, Solid Crystal Materials, Silica Gel, Fluorescent Powder, etc.)

- Fluorescent Powder, Quantum Dot Technology and Coating Technology

- Lens Design and Optic Module

- Chip level and Wafer Level Packaging Technology

- Multi-chip Packaging, Design and Optimization of COB

- New Development of Light Source with High Quality and Full Spectrum

- Advanced Packaging Technology and Manufacturing Technology with High Sigma and Low Color Tolerance

- The New Generation of LED Light Source and Light Engine

 

 

S202 Driver and Intelligent Control Technology

Intelligent lighting products has been gradually integrated  into the smart home system;  Intellectualization, digitalization and controllability are leading the development trend for future LED lighting industry,  from constantly improving and extending the life of driver circuit to keep pace with longer LED life, to gradually making progress in intelligent lighting. There are some important topics, such as thermal management and high performance driving scheme, new driving circuit and IC, LED dimming and color temperature technology, solution for controlling lighting products, wireless control technology, intelligent LED lighting and new Interconnect technology, intelligent LED lighting system and sensor technology etc.

 

Scope:

- Power Management and High Efficiency Driving Solutions

- IC New Drive Circuit and Integrated IC

- LED Dimming and Modulating Color Temperature Techniques

- Solution for Controlling Lighting Product

- Wireless Communications (ZigBee, Bluetooth, Wifi, Thread, etc.)

- Visible Light Communication Technologies and Applications (Lifi, etc.)

- Integration Of Intelligent Lighting and Smart Home System

- New Interconnection Technologies

- Intelligent LED Lighting System and Sensor Technology

- Modularization and Standardization of Drives

- Network Intelligent Lighting and POE Lighting Technologies

 

 

S203 LED lighting in Bio-Agriculture

Light is one of the most important factors in agricultural production, which plays a pivotal role in regulating growth and development of animal and plant as well as microorganism, and plays irreplaceable role in achieving high yield, high quality and high efficiency. Particularly in modern agricultural production systems, artificial light has been widely applied in new fields such as protected horticulture, intensive livestock & poultry culture, aquaculture and marine fishing, propagation of edible fungi and microalgae, and plant protection by trapping insects etc. Currently, the fundamental & application research of LED in bio-agriculture is very active, and some progress have been achieved in mechanisms of animal and plant responding to light quality, “light recipes” research, and LED light source creation in bio-agriculture and its application demonstration in modern agriculture etc. However, some fundamental theories and industry developmental orientations are needed to be further explored, such as establishing data base of light recipes for bio-agriculture, developing LED lighting facilities with high efficiency for bio-agriculture, jointing LED industry and modern agriculture industrial chain effectively, et al. Bio-agriculture session of SSLCHINA will assemble domestic and foreign experts to focus on the current hot points and leading questions of LED applied in agriculture, discuss the latest progress and development in mechanisms of animal and plant responding to light quality and “light recipes”, and explore new concepts, new technologies, and new achievements in LED combing with modern agriculture such as plant factory, seedling nursery, supplementary lighting in greenhouses, intensive livestock & poultry culture, propagation of edible fungi and microalgae, and plant protection by trapping insets. This session will provide a platform to explore these questions, catch the industry pulse and point out the orientation for the application of LED lighting in modern agriculture.

 

Scope:

- Advances in Biological (Animal and Plant) Responses to Light Qualities

- Bio-Agricultural Light Recipes Technology

- Manufacturing Technology and New Technology of Bio-Agricultural LED Lamps

- Advances in LED Modern Agriculture (Plant Factory, Seedling Nursery, Supplementary Lighting in Greenhouses, intensive livestock & poultry culture, Propagation of Edible Fungi and Microalgae Plant Protection by Trapping Insets)

- Energy Saving Design in LED for Bio-Agriculture

- New Materials and New Technologies of LED for Agriculture

- Design and Optimization of Low Cost LED for Agriculture

 

 

S204 Light Quality and Lighting for Health

With the development of LED lighting and its control technology, people begin to pursuit excellent optical quality to achieve the goals of health and colour quality. LED light source is compact, easy to control and adjustable which provides opportunities and challenges for providing lighting with good well-being and visual comfort, respectively. With the expanding of application requirements, it has important significance in upgrading LED light quality and providing better lighting environment by optimizing LED lighting and its control system and by using them in light environment design of indoor and outdoor.

More recently, due to in-depth study on the mechanism of the effect of light on human health and the success of LED device development, application of LED in daily life and medical light have increased, becoming a new blue ocean of LED application. But it still needs further discussion on the role and impact of visual development and visual physiology etc. A lot of problems on the device research and development are still needed further study by industry experts.

As for colour quality it is described to achieve visual perception of preference, vividness, naturalness, attractiveness, colour discrimination, etc, beyond a certain level of color fidelity.

 

Scope:

- Photobiological study of light radiation damage and health conditioning

- Study on the Mechanism for the Effects of Light to Visual Health

- Study on New LED Light Source for Health and Medical Applications

- Light Environment Design for Healthy Lighting

- Control Technologies for LED Healthy Lighting

- Quality Evaluation and Application of LED Light Environment

- Evaluation and Standardization for Healthy Lighting and Optical Medicine

- Clinical Trials of LED Phototherapy

- LED Typical Applications in Healthy Lighting and Optical Medicine

- Color quality measures such as color fidelity, color gamut, gamut shape, and whiteness

- Colour quality metrics to achieve visual comfort under different applications

 

S205 Technologies for Solid-State Ultraviolet Devices

The wide bandgap semiconductors have unmatchable advantages and great potential for ultraviolet (UV) devices compared with other semiconductor materials. This session focuses on the UV light-emitting materials represented by AlGaN and GaN, UV sensing materials represented by SiC and GaN, design and epitaxy of high-efficiency quantum structures, as well as novel fabrication and manufacturing technologies for UV devices such as light-emitting diodes, laser, photodetector, etc. This session also covers the advanced packaging materials and technology for UV devices, including the promotion mechanisms of light extraction, thermal management and device reliability, etc. In this session, domestic and foreign well-known experts from both academy and industry will be invited to deliver the latest most important progress in materials, devices, packaging and applications at all levels of wide bandgap semiconductors in UV light emitting and sensing areas.

 

Scope:

- AIN and Other Novel Substrate Materials for UV Optoelectronic Devices

- Design and Epitaxial Growth of Nitride Semiconductor UV Light Emitting and Detecting Materials

- P - Type Doping of AlGaN epitaxial films with High Al Composition

- High Efficiency Solid State Ultraviolet Light Emitting Devices

- High Sensitivity Ultraviolet Detection and Imaging Devices

- Light Extraction, Thermal Management and Reliability of Packaging and Modules of UV Light Source

- New Progress of Ultraviolet Light Source and Detection Application

 

W201 Technologies for SiC Materials and Devices

SiC power electronic devices are known to have advantages including high efficiency, high switching frequency and high operating temperature. They show great potential in applications such as renewable energy generation, electric vehicles and others. The continuous progress of SiC power electronic devices technology will play an important role in the development of power electronics. The topics of this session cover silicon carbide substrate, homoepitaxy, power electronic device. Well-known experts from home and abroad will be invited and latest research results will be presented in the session to demonstrate recent advances in SiC power electronic device technologies and applications.

 

Scope:

- Sic Crystal Growth and Processing

- Sic Homogeneity Epitaxy

- Defect Control and Characterization of SiC Materials

- Structure Design and Simulation of SiC Power Electronic Chip

- SiC Power Electronics Chip Technology

- Reliability of SiC Power Electronics

- Testing and Characterization of SiC Power Electronics

- Other New Technologies of SiC Power Electronic Chip

 

W202 Technologies for GaN Materials and Devices

GaN as one of the wide band-gap semiconductors has several advantages such high breakdown voltage, high switch frequency and low channel resistance, and can be fabricated by silicon integrated circuit process with ultra-low cost and ultra-high technology maturity. GaN power electronic devices have great application potential in the new generation of electric power conversion and management system with high efficiency and small size such as electric vehicles, industrial motors, etc. Besides SiC and GaN power electronic devices, the other novel wide band-gap semiconductors, such as Diamond, Ga2O3, etc, also have recently achieved technological breakthroughs. The topics in this session cover the technologies of lateral or vertical GaN epi-structures on large-size substrate, GaN power devices with novel structures and processes, the design and manufacture of GaN power modules with high speed and high efficiency, reliability and applications in GaN-based power system, etc. Well-known experts from home and abroad will be invited to give talks in this session. The latest progress in power electronic devices based on GaN will be presented.

 

Scope:

- GaN Based Heterostructure Epitaxial Growth and Defects, and Stress Control on Large Size Substrate

- GaN based Power Electronic Devices Technology

- GaN substrate Meterials and Homogeneous Epitaxial with Thick Film

- GaN Device Packaging Technology

- GaN Power Electronics Application

- Market Research of GaN Power Electronic Technology

- LED Photoelectric Materials

 

 

W203 RF Technology based on Wide Bandgap Semiconductors

Featured with High frequency, high efficiency and high power, the wide band gap semiconductor GaN based RF devices are now representing the great potential for the new generation of mobile communication technology. The breakthrough in this specific area is the new strategic highland of global semiconductor industry. The topics in this session cover GaN microwave devices and MMIC epitaxy, model, design and manufacturing, reliability and applications in mobile communications. The domestic and foreign well-known experts will be invited to give talks in this session. The latest progress of microwave devices and applications in wide bandage semiconductor will be presented.

 

Scope:

- High Efficiency GaN Microwave Device Technology

- GaN Epitaxial Technology for High Efficiency Microwave Device

- GaN Monolithic Microwave IC Design

- Process and Device Reliability of GaN Microwave Devices

- Large Signal Equivalent Circuit Modeling and Physical Modeling of GaN Microwave Devices

- Application of GaN devices and circuits in mobile communication

 

W204 Power Devices Packaging and Application

SiC/GaN Power Device Packaging and Reliability: In recent years, there have been breakthrough developments in technologies of wide bandgap (WBG) semiconductor power devices. These WBG devices have lower electrical resistance and faster switching characteristics than the state-of-the-art silicon devices to enable designs and manufacturing of power electronics converters with higher efficiency and higher power density. They are being extensively studied for applications in renewable energy generation, electric vehicles, charging piles, power conversion and management systems, industrial motor drives. Before WBG devices can be widely adopted in applications, advances in their packaging technologies and understanding of the reliability of packaged WBG devices are needed. This session is intended for the attendees to share their latest developments for integration of WBG power devices, such as device and or module package design, processing, packaging materials, reliability evaluation, etc. Domestic and international experts working on the listed areas are invited to submit papers and join fruitful discussions with other researchers and practitioners in the field.

 

Scope:

- Integration challenges of SiC/GaN Power Devices/Modules

- Package Design and Simulation for SiC/GaN Power Devices/modules

- Thermal Management for SiC/GaN Power Device/module Packaging

- Materials and Processing for SiC/GaN Power Device/Module Packaging

- Reliability Evaluation of Packaged SiC/GaN Power Devices/modules

- Gate Drive for SiC/GaN Power Devices/Modules

- Testing and Sensor Technologies for SiC/GaN Power Devices

- Applications for SiC/GaN Power Electronic Devices

- Other New Technologies for SiC/GaN Power Device Packaging

 

 

W205 Ultra-Wide Bandgap Semiconductor Technology

In recent years, people continue to get a breakthrough in the research and application of ultra-wide bandgap semiconductor materials represented by diamond, gallium oxide, aluminum nitride, boron nitride, etc. The ultra-wide bandgap semiconductor materials have a larger bandgap, higher thermal conductivity and better material stability, which have significant advantages and great potential for developing new generation of deep ultraviolet optoelectronic devices, high voltage/power electronic devices and other significant applications. This session focuses on the fabrication of the ultra-wide bandgap semiconductor materials, process technology, key equipment and device applications, aims at building a high-quality exchange platform for the communication among industry, academia and capital, discusses the new technologies and new trends of the ultra-wide bandgap semiconductor materials and devices.

 

Scope:

- Key equipment technology for fabrication of the ultra-wide bandgap semiconductors

- Fabrication and material study of the ultra-wide bandgap semiconductors

- Power electronics technology of the ultra-wide bandgap semiconductors

- Optoelectronic device technology of the ultra-wide bandgap semiconductors

- Research and application of other new semiconductor materials

 

S206/W206 Semiconductor Equipment Technologies and Intelligent Manufacturing

Because of the demands for high frequency, high-power microelectronic devices and higher luminous efficiency and shorter wavelength optoelectronic devices and further improvements in device performance have increased, equipment for III-nitride based material, equipment for new template material, high temperature epitaxial material equipment, novel chip, packaging equipment and new testing equipment, have been the top concerns of the research and industry on wide bandgap semiconductors and become the foundation and support for the development of novel semiconductor materials and device technologies.

In the sub-forum, the new opportunities for Made in China 2025 will be explored, and discussions and practical solutions will be made for hot topic including intelligent manufacturing, Industry 4.0, intelligent robot, intelligent plant, intelligent production line, intelligent logistics, MES system, etc.

 

Scope:

- Wide Bandgap Semiconductor Equipment (Including Solid State Lighting) for Epitaxial Materials And Substrate

- Wide bandgap Semiconductor Equipment for Device Fabrication

- Wide Bandgap Semiconductor Equipment (Including Solid State Lighting) for Packaging Fabrication

- Wide Bandgap Semiconductor Equipment (Including Solid State Lighting) for Material Analysis And Testing

- Wide Bandgap Semiconductor Equipment for Devices and Application Product Testing

- Other Wide Bandgap Semiconductor Equipments

 

 

S207/W207 Technologies for Reliability and Thermal Management

Chip junction temperature has always been an important factor limiting the function and lifetime of semiconductor devices, related thermal management technologies and reliability analysis have been involved from making a single product to managing the entire system. In the process, reliability of the whole system will be affected by advances in technologies such as novel materials for heat dissipation, thermal management technology, reliability oriented design, fault data and failure analysis, control and reliability screening in manufacturing process, accelerated life testing method, failure mode and simulation, etc..

 

Scope:

- Novel Materials for Heat Dissipation

- Thermal Management Technologies

- Reliability Oriented Design

- Fault Diagnosis and Prediction

- Failure Detection and Failure Analysis

- Accelerated Life Testing and Prediction Methods

- Failure Mode and Simulation

- Control and Reliability Screening in Manufacturing Process

 

 

S208/W208 Technologies for Micro-LED and Novel Display

Semiconductor light emission devices are the fundamental of displays and solid-state lighting. Novel display and lighting technologies have been well developed these years because of systematically investigation of various light emitting devices, and offer a bright future of versatile applications of information displays and lighting. The devices for novel display and lighting include: Micro-LED, Organic Light Emitting Diodes (OLEDs), Quantum Dot LEDs (QLEDs), LIMO laser, Perovskite LEDs (PerLEDs), and other novel Semiconductor light emitting device. Micro-LEDs have been developing particularly rapidly in recent years. Key technologies of these devices include: light emitting efficiency, working voltage, color rendering index, stability and reliability, Thermal Technology, etc. In terms of system application, novel backplane, drive and control circuit, panel manufacturing process, laser-related technologies, etc.，progress of these technologies is very important to novel displays and lighting technologies.

 

Scope:

- Technologies for Micro-LED Material, Devices and Application

- Technologies for OLED Material, Devices and Application

- Technologies for Laser Display and Lighting

- Technologies for QLED Material, Devices and Application

- PerLED and Other Novel Light Emitting Devices

- Reliability Technology for Light-Emitting Devices and Applications

- Advanced Thin Film Technology for Display

- Flexible Backplane And Packaging Technology

- Transparent Conductive Materials

-Circuit Drive and Control Technologies for Novel Diaplay

 

 

REVIEW PROCEDURE

1. Authors who would like to make Oral Presentation or Poster Presentation need to submit abstract in advance; Conference Proceedings Authors please submit full papers.

2. Authors prepare final submissions depending on the following status:

Oral Presentations: Authors need to prepare paper and presentation files (PPT/PDF)
Poster Presentations: Authors need to prepare paper and poster files (The Technical Program Committee will audit the posters and inform the authors. Authors need to prepare posters according to the template and bring the hardcopy posters to the designated Poster Display area for wall mounting)
Conference Proceedings: Authors should prepare the papers. Authors have to prepare final papers according to the guidelines and given template.
Note:

The templates can be downloaded from the paper contribution platforms of the forums (http://www.ifws.org.cn/en/paper & http://www.sslchina.org/en/paper). Authors are required to prepare papers and other materials based on the provided template in time to pass the review successfully.
High quality papers Contributed to SSLCHINA will be published in the Xplore IEEE electronic library after selection.