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艾会网学术会议报告库
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Observation of energy band separation of acoustic valley topological edge states
19th Asia-Pacific Vibration Conference
Huang Zhen
Xi'an Jiao Tong University
暂无会场信息
仅限参会人
口头报告
Frequency band-tunable topological edge state transmission via 2-bit coding acoustic topological metamaterials
19th Asia-Pacific Vibration Conference
Song Xinpei
Xi'an Jiaotong University
暂无会场信息
仅限参会人
口头报告
Topological Asymmetric Acoustic Transmission Based on Modes Conversion
19th Asia-Pacific Vibration Conference
Chen Chen
Xi'an Jiaotong University
暂无会场信息
仅限参会人
口头报告
Degradation mechanism of AlGaN/GaN high electron mobility transistors based on high temperature reverse bias stress
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
Lu Meng
湘潭大学
暂无会场信息
公开
张贴报告
ITC-Asia 2021 Closing Remark & Best Paper Award
2021 IEEE International Test Conference in Asia
Zhang Ying
Tongji University;
Li Huawei
University of Chinese Academy of Sciences;
Zebo Peng
Linkoping University;
Knoth Rob
Cadence;
Chang Soon-Jyh
National Cheng Kung University
CS /CS
2021年08月20日 22:30~22:45
公开
欢迎辞
Development and applications of packaging materials for power semiconductor devices
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
Chen Mingxiang
Huazhong University of Science and Technology (HUST)
K /K1
2021年08月26日 11:10~11:50
仅限参会人
特邀报告
Influence of CucorAl wire bonding on reliability of SiC devices
IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia
Chao Fang
,Zhuzhou CRRC Times Semiconductor Co., Ltd.
暂无会场信息
公开
张贴报告
A 3D coupled-inertial ultra-lightweight elastic metastructure exhibits omnidirectional, wide and low-frequency bandgaps
19th Asia-Pacific Vibration Conference
Ding Wei
Xi'an Jiaotong University
暂无会场信息
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口头报告
Analysis of planetary gearbox vibration mechanism based on signal response model
19th Asia-Pacific Vibration Conference
Yang Rui
Shandong Jianzhu University
暂无会场信息
仅限参会人
口头报告
Low frequency sound insulation of a perforated plate-type acoustic metamaterial
19th Asia-Pacific Vibration Conference
Liu Zhongyuan
Qingdao University of Technology
暂无会场信息
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口头报告
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