2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) The 10th Anniversary of International Conference on Electronic Packaging Technology(ICEPT) August 10 ~13 , 2009, Beijing, China On behalf of the China Electronic Packaging Society, Chinese Institute of Electronics (CIE-CEPS), it is my great pleasure to invite you to submit abstracts and attend 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2009), to be held in Beijing, China from August 10 to 13, 2009. Hosted by CIE-CEPS, the International Conference on Electronic Packaging Technology (ICEPT) will celebrate her 10th anniversary this year. In 1994, initiated by Tsinghua University, Fudan University, China Institute of Electronic Science, the 13th and 58th Research Institutes of CETC and others, the first International Symposium on Microelectronic Package & PCB Technology was held, which was the initiation of the ICEPT. This conference was held for nine times by 2008. They were organized in rotation by the leading universities in China, among which Tsinghua University held 3 times, and Fudan University, Harbin Institute of Technology, Huazhong University of Science & Technology, Shanghai Jiaotong University organized another 6 times. This conference has provided a great technical platform for international and domestic experts, scholars, and researchers from academia and industries to exchange their ideas on the development of electronic packaging. It was highly appreciated by China Institute of Electronics, China Association of Science, and the former Ministry of Information Industry, and greatly supported by IEEE-CPMT and IMAPS. In 2008, the ICEPT and the International Symposium on High Density Packaging (HDP), organized by Shanghai University, were merged as the International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP). It was successfully held in Shanghai, China and received great appreciation and supports from both academia and industries. ICEPT-HDP 2009 is a 4-day event, to be organized by Tsinghua University. The conference will feature short courses, conference keynotes, special forums and technical sessions to cover the technological developments in all the areas of electronics packaging. In conjunction with the conference, the ICEPT 10th Anniversary Celebration will be held. We sincerely invite all the leaders, experts, and peers who have been supporting this conference to come and meet in Beijing. 我代表中国电子学会生产技术学分会和电子封装专委会，诚挚地邀请各位封装界的朋友参加将于2009年8月10日~13日在北京举行的电子封装技术和高密度封装国际会议（ICEPT-HDP 2009），踊跃提交论文。 　　由中国电子学会生产技术学分会(CEPS)主办的电子封装技术国际会议(ICEPT)将迎来第十届庆典。1994年清华大学、复旦大学、中国电子科学院、电子13所与电子58所五个单位共同发起，由清华大学承办了首届电子封装国际会议。到2008年该会议已经由国内著名高校轮流承办了九届，其中清华大学承办了三届，其余六届分别由复旦大学、哈尔滨工业大学、华中科技大学和上海交通大学承办。该会议为国内外学术界、产业界的专家学者和科技人员提供了一个交流电子封装技术新进展、新思路的重要平台，得到了中国电子学会、中国科协、原信息产业部等上级单位的高度评价，并得到了国际著名行业组织IEEE-CPMT和IMAPS长期的支持。2008年，电子封装技术国际会议(ICEPT)和上海大学主办的高密度封装会议(HDP) 合并为电子封装技术和高密度封装国际会议(ICEPT-HDP)于上海隆重召开，得到国内外同仁热情支持和高度赞扬，会议取得圆满成功。 　　ICEPT-HDP’2009将于2009年 8 月10日~13 日在中国北京举行，由清华大学承办。会议将通过专题讲座、特邀报告、主题论坛、分会报告、论文张贴等形式对电子封装的各个技术领域中的最新进展进行交流。会议的详情和进展请随时查询会议网站www.icept.org，本届会议论文摘要的截止时间为2009年4月27日。 　　会议期间将举行第十届电子封装技术国际会议(ICEPT)庆典，届时邀请长期支持大会的领导、专家、同仁欢聚北京。