活动简介

ASMC is now soliciting abstracts in 20 topic areas from professionals involved in all areas of microelectronics manufacturing. Authors of selected papers will have an opportunity to present their work at the conference. They will also receive an invitation to publish their paper in a special section of ASMC 2017, which will be featured in IEEE Transactions on Semiconductor Manufacturing.

ASMC is the leading international technical conference for exploring solutions to improve the collective micro-electronics manufacturing expertise. The conference provides an unparalleled platform for semiconductor professionals to network and learn the latest information in the practical application of advanced manufacturing strategies and methodologies.  IEEE is a technical sponsor of ASMC 2017.

征稿信息

重要日期

2016-10-17
摘要截稿日期
2017-02-27
初稿截稿日期
2016-12-15
初稿录用日期
2017-04-17
终稿截稿日期

征稿范围

  • AEPM: Advanced Equipment Processes and Materials

  • AM: Advanced Metrology

  • AP/DFM: Advanced Patterning/Design for Manufacturability

  • APC: Advanced Process Control IE: Industrial Engineering

  • CFM: Contamination Free Manufacturing

  • DI: Defect Inspection and Reduction

  • DM: Data Management and Data Mining Tools

  • DP: Discrete and Power Devices

  • ER: Equipment Reliability and Productivity Enhancements

  • ET/ID: Enabling Technologies and Innovative Devices

  • FA: Factory Automation

  • FE: The Fabless Eperience

  • GF: Green Factory

  • LM: Lean Manufacturing

  • MJ: MOL and Junction Interfaces

  • SM: Smart Manufacturing

  • YE: Yield Enhancement/Learning

  • YM: Yield Methodologies

  • 3D/TSV: Packaging and Through Silicon Via

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重要日期
  • 会议日期

    05月15日

    2017

    05月18日

    2017

  • 10月17日 2016

    摘要截稿日期

  • 12月15日 2016

    初稿录用通知日期

  • 02月27日 2017

    初稿截稿日期

  • 04月17日 2017

    终稿截稿日期

  • 05月18日 2017

    注册截止日期

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