Technical Areas: The conference will solicit papers describing original work in RFIC design, system engineering, system simulation, design methodology, RFIC circuits, fabrication, testing, and packaging to support RF applications in areas such as, but not limited to: Wireless Mobile ICs: 3G/4G/LTE, WCDMA, TD-SCDMA, HSPA, WiMax, Mobile TV. Wireless Connectivity: WLAN, 802.11xx, Bluetooth, FM, GPS, UWB, Wireless HD. Low Power Transceivers: RFID, NFC, Zigbee, WPAN, WBAN, Biomedical, Sensor Nodes. RF Front-End Circuits: RF and mm-wave LNAs, mixers, VGAs, phase shifters, RF switches, integrated FEM. Mixed-Signal RF and Analog Baseband Circuits: RF and BB Converters (ADC/DAC), Sub-sampling/Oversampling Circuits, and all analog baseband circuits including filters and modulators. Reconfigurable and Tunable Front-Ends: SDR/Cognitive Radio, Wideband/Multi-band Front-Ends, Digital RF circuits/architectures, RF BIST, and reconfigurable data converters. Large-Signal Circuits: Power Amplifiers (RF & mm-Wave), Drivers, Advanced TX circuits, Linearization. VCOs and Frequency Multipliers: RF and mm-Wave VCOs, Frequency Multipliers. Frequency Generation Circuits: PLLs, Synthesizers, ADPLL, DDS, Frequency Dividers. Modeling and CAD: Active/Passive Devices, Packaging, EM Simulation, Co-Simulation. Device Technologies: CMOS, SOI, SiGe, GaAs, MEMS, Integrated Passives, Reliability, Characterization, Testing. mm-Wave SOCs: mm-wave SOC and SIP systems above 20GHz for data, video, imaging apps, beam steering. High-Speed Data Transceivers: Wireline, Wireless, Optical Transceivers, CDRs for High-Speed Data links.