The RFIC Symposium kicks off Microwave Week on Sunday, 6 June 2021 with twelve workshops and a lunchtime technical lecture focused on the fundamentals of power amplifier design. This will be followed our plenary session, where we will feature two thought-provoking keynotes from world-renowned experts, and a symposium showcase, where we will highlight top papers from industry and student authors. Our technical program continues on Monday, June 7th and Tuesday, June 8th, and authors will present their work throughout both days. We will also have two engaging lunch-time panel sessions, covering the topics of AI for automotive radar and new realities for RFIC startups. Finally, the IMS 2021 exhibition opens on Tuesday, where attendees can learn about the latest technologies across the microwave industry.
As in 2020, the 2021 RFIC Symposium continues with an expanded scope to include systems and applications for cutting-edge research in 5G, radar, imaging, biomedical, optoelectronic, and machine-learning areas. Also, a rich and diverse program for our students will continue in 2021, including a best student paper contest, a virtual three-minute thesis (3MT) contest, a deeply-discounted student Superpass, and programs for both volunteers and Ph.D. students.
Sponsor Type:1; 1; 1
General Chair
Brian Floyd, North Carolina State Univ.
Technical Program Chair/Vice-Chair
Osama Shanaa, MediaTek
Donald Y.C. Lie, Texas Tech. Univ.
Publication Chair/Vice-Chair
Gernot Hueber, Silicon Austria Labs
Francois Rivet, Univ. of Bordeaux
Publicity Chair/Vice-Chair
Amin Arbabian, Stanford Univ.
Hongtao Xu, Fudan Univ.
Workshop Chair/Co-Chair
Danilo Manstretta, Univ. of Pavia
Mona Hella, Rensselaer Polytechnic Inst.
Session Organization Chair
Steven Turner, BAE Systems
Panel Sessions Chair
Jennifer Kitchen, Arizona State Univ.
Systems & Applications Forum Chair
Oren Eliezer, Ambiq
Student Papers Chair
Danilo Manstretta, Univ. of Pavia
Submission Website Chair
Steven Turner, BAE Systems
Secretary
Domine Leenaerts, NXP Semiconductors
Asia Pacific Liaison
Hongtao Xu, Fudan Univ.
European Liaison
Gernot Hueber, Silicon Austria Labs
Industry Submissions Liaison
Fred Lee, Verily Life Sciences
Transactions JSSC Guest Editor
Mohyee Mikhemar, Broadcom
Transactions TMTT Guest Editor
Bodhisatwa Sadhu, IBM
Visa Letters
Zaher Bardai, IMN Epiphany
Website Chair
Michael Oakley, Raytheon Technologies
The symposium solicits papers describing original work in all areas related to RF, millimeter-wave, THz, and wireless ICs and systems. Work must be demonstrated through IC hardware results and measurements.
06月06日
2021
06月08日
2021
初稿截稿日期
注册截止日期
2023年06月18日 美国 San Diego
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