“IEEE CPMT Symposium Japan” is recognized international symposium for leading-edge packaging technologies. The symposium started as “The VLSI Packaging Workshop in Japan” in 1992 and held every two years. To cover the wide area of electronics packaging, the committee refurbished the workshop, and started the new symposium in 2010. And due to ever increasing recent electronics demands, we expanded it to an annual event in 2013. IEEE CPMT Symposium Japan will provide component, packaging, and manufacturing researchers who are extending their activities beyond borders with opportunities to exchange technical knowledge and perspective. This year's Symposium will mainly focus on packaging technologies for optoelectronics, RF/high-speed electronics and bioelectronics. And other topics of primary interest to the participants are listed below. Bring your latest research results and share with the participants who are experts from the industry and the academia, and discuss with them. Anybody contributing to the achievement of a sustainable society through electronics is very welcome at this symposium. The following areas of technology are primary interest to the participants: