活动简介

hank you for attending IEEE CPMT Symposium Japan 2017. On behalf of the committee of IEEE CPMT Symposium Japan, it is our great pleasure to have all of you again in Kyoto. This symposium had started as VLSI Packaging Workshop in Japan in 1992, held in Kyoto every 2 years, to discuss packaging technologies for VLSI chips. The workshop was founded by Otsuka-sensei from Meisei University. In 2010, the workshop was renovated as IEEE CPMT Symposium Japan. As technology innovation keeps getting faster, the symposium has become an annual event starting 2012. So quarter century has passed since the first event and this year's symposium is the 7th time of ICSJ. So this year's ICSJ will be a memorial symposium for all of you.

         Then, please let me change the subject and tell a personal story. I was born in Hiroshima, but I was not raised in Hiroshima. I was born there and grew up there until three years because of my father's business. So I have only a few memories of Hiroshima. But Hiroshima is sometimes on my mind. As you know, Hiroshima is the city where the atomic bomb was dropped for the first time. It was about twenty years before I was born. Last year, Barack Obama at the time of the President of the United States came to Hiroshima and made the speech for our future peace at Hiroshima Peace Memorial Park. It was very impressive event for me. Also I think it is very meaningful that people get together at that place, Hiroshima and think about peace, human behavior and also usage of technologies. The discovery of radiation followed by the discovery of nuclear energy was a major step in science and technologies for human being. However, if we make a mistake in using new technologies, they can cause a big tragedy that we did not suspect. Hiroshima speaks of it to us silently. Our field; semiconductor technologies are no exception to make a mistake in usage. We also have risk that our technologies might be used for threatening peace. Unfortunately, we have known that military applications have been the driving force for the development of new technologies historically. But I would like to dare to say that our new technologies should be only used for human happiness. The aim of human happiness will lead the development of new technologies. I hope this symposium will support this kind of point of view.

         This year's theme is "Integrated package all around your life". Integrated Package is one of the key technologies and exists all around your life. ICSJ2017 will emphasize three main topics: Fan-Out technologies, Optoelectronics and Heterogeneous Integration Roadmap. There must be greater opportunity to create novel technologies. Many material and equipment will be needed to create Integrated Package. In Japan, there are many materials and equipment companies to support this innovative motivations. ICSJ provides a place for professionals to communicate with each other.

         Finally, thank you again for all. This Symposium will be supported by all the presenters and all the audience. You are the ICSJ2017. I expect that this symposium provides you a great opportunity to interact with professionals from variety of technology for your future works. I hope ICSJ2017 will be the memorable beginning for your innovations from Japan.

征稿信息

重要日期

2018-05-25
摘要截稿日期
2018-09-07
初稿截稿日期
2018-07-06
初稿录用日期

“IEEE CPMT Symposium Japan (ICSJ)” is a widely-recognized international conference of the IEEE CPMT Society, and held annually in Kyoto in November. ICSJ will provide a platform for you to communicate and interact with global leaders in packaging technology.

Integrated Package all around your life: The conference started in 1992 as "The VLSI Packaging Workshop in Japan" and was renamed to "ICSJ" in 2010 and will focus on a variety of packaging technologies. Internet of Things (IoT) will make revolutionary changes to the packaging technologies for smarter usage of the devices in various application fields such as healthcare, Industry 4.0, automotive, and so on. The IoT will be supported by “Integrated Package” which is composed of various types of devices (sensors, RFIDs, MEMS, wireless components, etc.). Integrated Package is one of the key technologies and exists all around your life. In 2017, the conference will feature three main topics: Fan-Out technologies, Optoelectronics and Heterogeneous Integration Roadmap. Additional topics of primary interest to the participants are listed below.

Other topics include (but not limited to):

+ 3D Packaging & Chip on Chip

+ Advanced Fine Pitch Packaging, Micro Bumping, Wafer Level CSP

+ Board-Level Integration & Integrated Substrate

+ Laminated Materials & Processing, Materials for Packaging

+ Thermal Management

+ Reliability & Failure Mechanisms

+ Packaging for High-Speed Electrical Interconnect

+ Signal Integrity / Power Integrity

+ RF Components & Modules

+ Packaging for Bio-Healthcare & Wearable

+ Packaging for Automotive & Power Electronics

+ Additive Manufacturing, 3D Printed Electronics

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重要日期
  • 会议日期

    11月19日

    2018

    11月21日

    2018

  • 05月25日 2018

    摘要截稿日期

  • 07月06日 2018

    初稿录用通知日期

  • 09月07日 2018

    初稿截稿日期

  • 11月21日 2018

    注册截止日期

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