活动简介
The International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) provides an open forum for the presentation of the latest results and trends in process and device simulation. The conference is the leading forum for Technology Computer-Aided Design (TCAD) and is held annually.
The 18th edition of the conference will be held on September 3-5, 2013.
征稿信息
征稿范围
The scope of the conference includes:
Simulation and modelling based on continuum, particle or quantum transport methods for electronic devices including FinFETs, ultra-thin SOI, optoelectronics devices, lasers, TFTs, spintronics devices, carbon nanotube
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重要日期
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会议日期
09月03日
2013
至09月05日
2013
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09月05日 2013
注册截止日期
主办单位
IEEE Electron Devices Society
历届会议
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2017年09月07日 日本 Kamakura,Japan
2017 International Conference on Simulation of Semiconductor Processes and Devices -
2016年09月06日 德国 Nuremberg, Germany
2016年国际模拟半导体工艺和设备会议
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