EOS/ESD Association, Inc. is sponsoring the 2024 International EOS/ESD Symposium on Design and System (IEDS). IEDS 2024 is dedicated to the fundamental understanding of issues related to ESD on design and system and the application of this knowledge to the solution of problems. The TPC solicits Symposium contributions, including data and analysis that advance the state-of-the-art knowledge, enhance or review the general knowledge, or discuss new topics related to on-chip ESD design, system ESD design, and EOS/ESD issues in manufacturing.
Conference Advisory Chair
Hanming Wu, Zhejiang University
Ming-Dou Ker, National Yang Ming Chiao Tung University
Conference Chair
Emeritus Junjun Li, ESDA
Shurong Dong, Zhejiang University
Conference Chair
Rui Zhang, Zhejiang University
Conference Co-Chair
Shih-Hung Chen, IMEC
Technical Program Chair
Chun-Yu Lin, National Taiwan Normal University
Technical Program Co-Chair
Jie Zeng, GLOBALFOUNDRIES
Workshop Chair
Guangyi Lu, HiSilicon
Local Arrangement Chair
Qiang Cui, Zhejiang University
Publicity Chair(s)
Bernard Chin, Qorvo
Xiaozong Huang, CETC-24
Xiangliang Jin, Hunan Normal University
Huijuan Wang, Honor
Yafei Yuan, BOIMT
Sen Zhang, CSMC
Yulong Zhu, Hanwa
Conference Event Manager
Christina Earl, ESDA Business Operations Manager
Conference Technical Advisor
Nathaniel Peachey, Qorvo, ESDA Senior Vice President
Conference Program Advisor
Lisa Pimpinella, ESDA Executive Director
EOS/ESD Association, Inc. is sponsoring the 3rd International EOS/ESD Symposium on Design and System (IEDS). IEDS 2024 is dedicated to the fundamental understanding of issues related to electrostatic discharge on design and system and the application of this knowledge to the solution of problems. The Technical Program Committee solicits symposium contributions, including data and analysis that advance the state-of-the-art knowledge, enhance or review the general knowledge, or discuss new topics related to on-chip ESD design, system ESD design, and EOS/ESD issues in manufacturing. The Technical Program Committee is inviting papers related, but not limited, to the following tracks:
Advanced CMOS EOS/ESD and Latch-up
ESD protection in Bipolar, RF, High-voltage, and BCD technologies
ESD modeling, simulation and design automation
EOS/ESD Failure analysis and case studies
ESD and Latch-up testing
System ESD design and troubleshooting issues
ESD manufacturing control issues and target discussion
Device, circuit and product reliability
Authors must submit a maximum 50-word abstract and maximum 4-page summary of their work. The summary must clearly state the purpose, results (e.g., data, diagrams, photographs, etc.), and conclusions of the work. Summaries must also include references to prior publications and state how the work enhances existing knowledge. Authors suggest the technical area related to their submission. Abstract submissions can be made electronically at: https://softconf.com/n/eos-esd2024
05月08日
2024
05月10日
2024
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