Electrostatic discharge (ESD),Electrical Overstress (EOS),System-level design,System-on-chip,Electrostatic,Static Electricity,Electronic component,Integrated Circuits,3d-integration Packaging Technologies,ANSI standards,Transmission Line Pulse,Human Body Model,Charged Device Model,PMOS,NMOS,SEED,Advanced CMOS,FinFETs,Emc Measurements,electronic design automation,charged board event,Foundries,BCD,High-voltage techniques,case studies,ESD modeling,ESD simulation,2D-Inte5g Mobile Communication.
Scope:EOS/ESD Association, Inc. is sponsoring the 2024 International EOS/ESD Symposium on Design and System (IEDS). IEDS 2024 is dedicated to the fundamental understanding of issues related to ESD on design and system and the application of this knowledge to the solution of problems. The TPC solicits Symposium contributions, including data and analysis that advance the state-of-the-art knowledge, enhance or review the general knowledge, or discuss new topics related to on-chip ESD design, system ESD design, and EOS/ESD issues in manufacturing.

 IEEE Electromagnetic Compatibility Society IEEE Electron Devices Society IEEE Reliability Society