AboutCommunication, Networking and Broadcast Technologies; Components, Circuits, Devices and Systems; Photonics and Electrooptics; Power, Energy and Industry Applications; Signal Processing and Analysis
Keywords:Electronics packaging,Advanced packaging,interposers,Packaging and Interconnections,Bump formation,Signal and power integrity,Printed circuit board,Novel materials and processing,Printed electronics,3D IC,tsv,Bonding processes,wafer bonding,Thermal management,Integrated optoelectronics,Optical interconnects,MEMS packaging,Nanoimprint lithography,Organic semiconductors,Assembly,Power devices,RFID tags,
Scope:ICEP is the international conference covering wide ranges of electronics packaging technologies, such as advanced packaging, new materials, fabrication process, modeling/simulation, and applications.
Sponsor Type:1; 5; 9