活动简介

ICICM is an annual conference, which aims to provide a platform for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research results and development activities in Integrated Circuits and Microsystems. ICs are now used in virtually all electronic equipment and have revolutionized the world of electronics. Computers, mobile phones, and other digital home appliances are now inextricable parts of the structure of modern societies, made possible by the small size and low cost of ICs. Integrated circuit plays a vital role in electronic information era, which now is becoming a first-class discipline in China. In order to promote the development of ICs, ICICM provides opportunities for the delegates to exchange new ideas and research findings face to face, to establish business or research relations and to find global partners for future collaboration.

The previous 6 editions ICICM have been successfully held in Chengdu on November 23-25, 2016; in Nanjing on November 8-11, 2017; in Shanghai on November 24-26, 2018; in Beijing on October 25-27,2019 and in Nanjing on October 23-25, 2020 and Oct 22-24, 2021. On the basis of success of the previous 6 year, we are proud to announce 2022 The 7th International Conference on Integrated Circuits and Microsystems (ICICM 2022) will be held in Xi'an, China on October 28-31, 2022, which is co-sponsored by Southeast University, China and University of Electronic Science and Technology of China, hosted by Xi'an University of Posts&Telecommunications, China, and technically assisted by by many local and international universities.

组委会

Advisory Chairs

Ljiljana Trajkovic, Simon Fraser University, Canada

Conference Chairs

Zhigong Wang, Southeast University, China

Qiang Li, University of Electronic Science and Technology of China, China

Huimin Du, Xi'an University of Posts&Telecommunications, China

Conference Co-Chairs

Letian Huang, University of Electronic Science and Technology of China, China

Xiulong Wu, Anhui University, China    

Junyong Deng, Xi'an University of Posts&Telecommunications, China

Program Chairs

Jiliang Zhang, Hunan University, China

Shengbing Zhang, Northwestern Polytechnical University, China

Huiyong Hu, Xidian University, China

Junwei Du, Qingdao University of Science and Technology, China

Shulin Liu, Xi'an University of Science and Technology, China

Ning Xu, Wuhan University of Technology, China

Jun Cheng, Xi'an Jiaotong University, China

Yasuo Watanabe, Institute of Electronics, Information and Communication Engineers (IEICE), Japan

Program Co-Chairs

Abdel-Hamid Ali Soliman, Staffordshire University, UK

Alex Yakovlev, Newcastle University, UK.

Peng Liu, Zhejiang University, China

Zhengfeng Huang, Hefei University of Technology, China

Youyao Liu, Xi'an University of Posts&Telecommunications, China

Ningmei Yu, Xi'an University of Technology, China

Jidong Zhai, Tsinghua University, China

Guojie Luo, Peking University, China

Zhen Hua, Shandong Technology and Business University, China

Xinying Li, Henan University, China

Hui Xu, Anhui University of Science and Technology, China

Zhuo Zou, Fudan University, China

Students Program Chairs

Meng Zhang, Southeast University,China

Delong Shang, Institute of Microelectronics of the Chinese Academy of Sciences, China

Sarawuth Chaimool, Khon Kaen University (KKU), Thailand

Program Committee

Xingyuan Tong, Xi'an University of Posts and Telecommunications, China

Naijin Chen, Anhui Polytechnic University, China

Zhixiong Di, Southwest Jiaotong University, China

Wei Hu, Northwestern Polytechnical University, China

Gang Jin, Xidian University, China

Leilei Liu, Nanjing University of Posts and Telecommunications, China

Fan Ye, Fudan University, China

Jincan Zhang, Henan University of Science and Technology, China

Qifeng Zhao, Zhongyuan University of Technology, China

Publicity Chairs

Jeff Kilby,  Auckland University of Technology, New Zealand

Fei Xia, Newcastle University, UK

Wu Gao, Northwestern Polytechnical University, China

Huizhen Qian, University of Electronic Science and Technology of China, China

Nan Chen, Northwestern Polytechnical University, China

Qiang Wu, Southwest Jiaotong University, China

Yuxiang Huan, Guanodong Institute of Inteligence Science and Technology, China

Industry Liaison Chairs

Shuang Song, Facebook

Xia Zhang, Qingdao Qing Ruan Jing Zun Microelectronics Technology Co.,Ltd

征稿信息

重要日期

2022-08-15
初稿截稿日期
2022-09-05
初稿录用日期

征稿范围

Thz and Microwave MicroSystem

Devices and Circuits for Wirless System

Application Specific Circuits and Systems for Communication

Digital, Analog, Mixed Signal IC and SOC design technology

Silicon integrated circuits and manufacturing

Low-power, RF devices & circuits

IC Computer-Aided –Design technology, DFM

Silicon/germanium devices and device physics

Interconnect, Low K, High K and other process technologies

Unconventional and nano-electronics

Organic semiconductor devices and technologies

Compound semiconductor devices and circuits

Displays, sensors and MEMS

Semiconductor materials and material characterization

Packaging and testing technology

Solar cell & other devices for new energy sources

Modeling and simulation

Equipment technology

Reliability

Displays, sensors and MEMS

Advance memories technology

(Flash, FeRAM, PCM,ReRAM, MRAM etc.)

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重要日期
  • 会议日期

    10月28日

    2022

    10月31日

    2022

  • 08月15日 2022

    初稿截稿日期

  • 09月05日 2022

    初稿录用通知日期

  • 10月31日 2022

    注册截止日期

主办单位
Southeast University, China
University of Electronic Science and Technology of China
IEEE CASS
承办单位
Xi'an University of Posts&Telecommunications, China
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